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ST7L05, ST7L09
8-bit MCU for automotive with single voltage Flash memory, data EEPROM, ADC, timers, SPI
Features
Memories - 1.5 Kbytes program memory: Single voltage extended Flash (XFlash) with read-out protection capability, In-Application Programming (IAP) and In-Circuit Programming (ICP) for XFlash devices - 128 bytes RAM - 128 bytes data EEPROM with read-out protection, 300K Write/Erase cycles guaranteed - XFlash and EEPROM data retention: 20 years at 55C Clock, Reset and Supply Management - Clock sources: High precision internal RC oscillator or external clock - PLL x8 for 8 MHz internal clock - 4 Power Saving Modes: Halt, Active Halt, Wait and Slow Interrupt Management - 10 interrupt vectors plus TRAP and RESET - 4 external interrupt lines (on four vectors) I/O Ports - 13 multifunctional bidirectional I/O lines - 9 alternate function lines - 6 high sink outputs 2 Timers - One 8-bit Lite Timer (LT) with prescaler including: Watchdog, one realtime base and one input capture - One 12-bit Autoreload Timer (AT) with output compare function and PWM
ST7L05 1.5 Kbytes Flash 128 bytes (64 bytes)
SO16 150mil
1 Communication Interface - SPI synchronous serial interface A/D Converter - 8-bit resolution for 0 to VDD - 5 input channels Instruction Set - 8-bit data manipulation - 63 basic instructions with illegal opcode detection - 17 main addressing modes - 8 x 8 unsigned multiply instruction Development Tools - Full hardware/software development package

Table 1. Device Summary
Features Program Memory RAM (stack) Data EEPROM Peripherals Operating Supply CPU Frequency Operating Temperature Packages ST7L09
128 bytes Lite Timer with Watchdog, Autoreload Timer with 1 PWM, SPI, 8-bit ADC 3.0 to 5.5V Up to 8 MHz (with external resonator/clock or internal RC oscillator) Up to -40 to +85C, -40 to +105C SO16 150mil
Rev. 3
December 2006 1/104
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Table of Contents
1 DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 PIN DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 REGISTER AND MEMORY MAP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4 FLASH PROGRAM MEMORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4.2 4.3 4.4 4.5 4.6 MAIN FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 PROGRAMMING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 ICC INTERFACE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 MEMORY PROTECTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 RELATED DOCUMENTATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5 DATA EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 5.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 5.2 5.3 5.4 5.5 5.6 5.7 MAIN FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 MEMORY ACCESS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 POWER SAVING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 ACCESS ERROR HANDLING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 DATA EEPROM READ-OUT PROTECTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 REGISTER DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
6 CENTRAL PROCESSING UNIT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 6.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 6.2 6.3 MAIN FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 CPU REGISTERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
7 SUPPLY, RESET AND CLOCK MANAGEMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 7.1 INTERNAL RC OSCILLATOR ADJUSTMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 7.2 7.3 7.4 PHASE LOCKED LOOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 REGISTER DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 RESET SEQUENCE MANAGER (RSM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
8 INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 8.1 NON-MASKABLE SOFTWARE INTERRUPT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 8.2 8.3 EXTERNAL INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 PERIPHERAL INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
9 POWER SAVING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 9.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 9.2 9.3 9.4 SLOW MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 WAIT MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 ACTIVE HALT AND HALT MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
10 I/O PORTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 10.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 10.2 FUNCTIONAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 10.3 UNUSED I/O PINS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 104 10.4 LOW POWER MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 10.5 INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
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10.6 I/O PORT IMPLEMENTATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 11 ON-CHIP PERIPHERALS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 11.1 LITE TIMER (LT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 11.2 12-BIT AUTORELOAD TIMER (AT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 11.3 SERIAL PERIPHERAL INTERFACE (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 11.4 8-BIT A/D CONVERTER (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 12 INSTRUCTION SET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 12.1 ST7 ADDRESSING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 12.2 INSTRUCTION GROUPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 13 ELECTRICAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 13.1 PARAMETER CONDITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 13.2 ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 13.3 OPERATING CONDITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 13.4 SUPPLY CURRENT CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 13.5 CLOCK AND TIMING CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 13.6 MEMORY CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 13.7 EMC CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 13.8 I/O PORT PIN CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 13.9 CONTROL PIN CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 13.10 COMMUNICATION INTERFACE CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . 89 13.11 8-BIT ADC CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 14 PACKAGE CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 14.1 PACKAGE MECHANICAL DATA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 14.2 THERMAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 14.3 SOLDERING INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 15 DEVICE CONFIGURATION AND ORDERING INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . 96 15.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 15.2 OPTION BYTES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 15.3 FLASH DEVICE ORDERING INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 15.4 TRANSFER OF CUSTOMER CODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 16 DEVELOPMENT TOOLS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101 16.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101 16.2 DEVELOPMENT AND DEBUGGING TOOLS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101 16.3 PROGRAMMING TOOLS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101 16.4 ORDER CODES FOR DEVELOPMENT AND PROGRAMMING TOOLS . . . . . . . . . . 101 16.5 ST7 APPLICATION NOTES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101 17 KNOWN LIMITATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 17.1 EXECUTION OF BTJX INSTRUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 17.2 IN-CIRCUIT PROGRAMMING OF DEVICES PREVIOUSLY PROGRAMMED WITH HARDWARE WATCHDOG OPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 17.3 IN-CIRCUIT DEBUGGING WITH HARDWARE WATCHDOG . . . . . . . . . . . . . . . . . . . 102 17.4 CLEARING ACTIVE INTERRUPTS OUTSIDE INTERRUPT ROUTINE . . . . . . . . . . . . 102 18 REVISION HISTORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
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To obtain the most recent version of this datasheet, please check at www.st.com>products>technical literature>datasheet
Please also pay special attention to the Section "KNOWN LIMITATIONS" on page 102.
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ST7L05, ST7L09
1 DESCRIPTION
The ST7L0x is a member of the ST7 microcontroller family suitable for automotive applications. All ST7 devices are based on a common industrystandard 8-bit core, featuring an enhanced instruction set. The ST7L0x features Flash memory with byte-bybyte In-Circuit Programming (ICP) and In-Application Programming (IAP) capability. Under software control, the ST7L0x devices can be placed in WAIT, SLOW, or HALT mode, reducing power consumption when the application is in idle or standby state. The enhanced instruction set and addressing modes of the ST7 offer both power and flexibility to software developers, enabling the design of highly efficient and compact application code. In addition to standard 8-bit data management, all ST7 microcontrollers feature true bit manipulation, 8 x 8 unsigned multiplication and indirect addressing modes. For easy reference, all parametric data is found in Section 13 on page 73.
Figure 1. General Block Diagram
1 MHz RC OSC + PLL x8
Internal CLOCK
LITE TIMER w/ WATCHDOG VDD VSS RESET POWER SUPPLY
ADDRESS AND DATA BUS
PORT A 12-bit AUTORELOAD TIMER
PA7:0 (8 bits)
CONTROL 8-bit CORE ALU FLASH MEMORY (1.5 Kbytes)
SPI PB4:0 (5 bits)
PORT B
8-bit ADC RAM (128 bytes)
DATA EEPROM (128 bytes)
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2 PIN DESCRIPTION
Figure 2. 16-Pin Package Pinout (150mil)
k
VSS VDD RESET SS/AIN0/PB0 SCK/AIN1/PB1 MISO/AIN2/PB2 MOSI/AIN3/PB3 CLKIN/AIN4/PB4
1 2 3 4 ei3 5 6 7 ei2 8
ei0 16 15 14 13 12 11 10 ei1 9
PA0 (HS)/LTIC PA1 (HS) PA2 (HS)/ATPWM0 PA3 (HS) PA4 (HS) PA5 (HS)/ICCDATA PA6/MCO/ICCCLK PA7
(HS) 20mA high sink capability eix associated external interrupt vector
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PIN DESCRIPTION (Cont'd) Legend / Abbreviations for Table 2: Type: I = input, O = output, S = supply In/Output level: C= CMOS 0.15VDD/0.85VDD with input trigger CT= CMOS 0.3VDD/0.7VDD with input trigger Output level: HS = 20mA high sink (on N-buffer only) Port and control configuration: - Input: float = floating, wpu = weak pull-up, int = interrupt1), ana = analog - Output: OD = open drain, PP = push-pull Table 2. Device Pin Description
Level Input Pin Name Output Pin No. Type Port / Control Input float wpu ana int Output OD PP Main Function (after reset) Ground Main power supply CT CT X X ei3 X X X X Top priority non-maskable interrupt (active low) Port B0 ADC Analog Input 0 or SPI Slave Select (active low) ADC Analog Input 1 or SPI Clock Caution: No negative current injection allowed on this pin. For details, refer to Section 13.2.2 on page 74. ADC Analog Input 2 or SPI Master In/ Slave Out Data ADC Analog Input 3 or SPI Master Out / Slave In Data ADC Analog Input 4 or External clock input Main Clock Output/In-Circuit Communication Clock. Caution: During normal operation this pin must be pulled- up, internally or externally (external pull-up of 10k mandatory in noisy environment). This is to avoid entering ICC mode unexpectedly during a reset. In the application, even if the pin is configured as output, any reset will put it back in input pull-up. In-Circuit Communication Data Alternate Function
1 2 3 4
VSS VDD RESET PB0/AIN0/SS
S S I/O I/O
5
PB1/AIN1/SCK
I/O
CT
X
X
X
X
X
Port B1
6 7 8 9
PB2/AIN2/MISO PB3/AIN3/MOSI PB4/AIN4/CLKIN PA7
I/O I/O I/O I/O
CT CT CT CT
X X X X
X ei2 X ei1
X X X
X X X X
X X X X
Port B2 Port B3 Port B4 Port A7
10 PA6 /MCO/ICCCLK
I/O
CT
X
X
X
X
Port A6
11
PA5/ ICCDATA
I/O CT HS I/O CT HS I/O CT HS I/O CT HS
X X X X
X X X X
X X X X
X X X X
Port A5 Port A4 Port A3 Port A2
12 PA4 13 PA3 14 PA2/ATPWM0
Autoreload Timer PWM0
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Level Input Pin Name Output Pin No. Type Port / Control Input float wpu ana int Output OD PP Main Function (after reset) Port A1 Port A0 Lite Timer Input Capture Alternate Function
15 PA1 16 PA0/LTIC
I/O CT HS I/O CT HS
X X
X ei0
X X
X X
Note: In the interrupt input column, "eix" defines the associated external interrupt vector. If the weak pull-up column (wpu) is merged with the in-
terrupt column (int), then the I/O configuration is pull-up interrupt input, else the configuration is floating interrupt input.
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ST7L05, ST7L09
3 REGISTER AND MEMORY MAP
As shown in Figure 3, the MCU is capable of addressing 64 Kbytes of memories and I/O registers. The available memory locations consist of up to 128 bytes of register locations, 128 bytes of RAM, 128 bytes of data EEPROM and up to 1.5 Kbytes of user program memory. The RAM space includes up to 64 bytes for the stack from 0C0h to 0FFh. The highest address bytes contain the user reset and interrupt vectors. Figure 3. Memory Map
0000h 007Fh 0080h 00FFh 0100h
The size of Flash Sector 0 is configurable by Option byte. IMPORTANT: Memory locations marked as "Reserved" must never be accessed. Accessing a reserved area can have unpredictable effects on the device.
HW Registers (see Table 3) RAM (128 Bytes) Reserved
0080h
Short Addressing RAM (zero page)
00BFh 00C0h
64 Bytes Stack
00FFh 1000h
0FFFh 1000h 107Fh 1080h
RCCR0 RCCR1 see Section 7.1 on page
Data EEPROM (128 Bytes)
1001h
Reserved
F9FFh FA00h
1.5K FLASH PROGRAM MEMORY
FA00h
Flash Memory (1.5K)
FFDFh FFE0h
FBFFh FC00h FFFFh
0.5 Kbytes SECTOR 1 1 Kbytes SECTOR 0 FFDEh
Interrupt & Reset Vectors (see Table 7)
RCCR0 RCCR1 see Section 7.1 on page
FFDFh
FFFFh
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REGISTER AND MEMORY MAP (Cont'd) Legend: x = undefined, R/W = read/write Table 3. Hardware Register Map
Address 0000h 0001h 0002h 0003h 0004h 0005h 0006h to 000Ah 000Bh 000Ch 000Dh 000Eh 000Fh 0010h 0011h 0012h 0013h 0014h to 0016h 0017h 0018h 0019h to 002Eh 0002Fh 00030h 0031h 0032h 0033h 0034h 0035h 0036h 0037h 0038h 0039h 003Ah 003Bh to 007Fh FLASH EEPROM SPI FCSR EECSR SPIDR SPICR SPICSR ADCCSR ADCDR ADCCSR2 EICR MCCSR RCCR SICSR AUTORELOAD DCR0H TIMER DCR0L LITE TIMER LTCSR LTICR Block Register Label PADR PADDR PAOR PBDR PBDDR PBOR Register Name Port A Data Register Port A Data Direction Register Port A Option Register Port B Data Register Port B Data Direction Register Port B Option Register Reserved area (5 bytes) Lite Timer Control/Status Register Lite Timer Input Capture Register Timer Control/Status Register Counter Register High Counter Register Low Autoreload Register High Autoreload Register Low PWM Output Control Register PWM 0 Control/Status Register Reserved area (3 bytes) PWM 0 Duty Cycle Register High PWM 0 Duty Cycle Register Low Reserved area (22 bytes) Flash Control/Status Register Data EEPROM Control/Status Register SPI Data I/O Register SPI Control Register SPI Control/Status Register A/D Control Status Register A/D Data Register Control Status Register 2 External Interrupt Control Register Main Clock Control/Status Register RC oscillator Control Register System Integrity Control/Status Register Reserved area (69 bytes) 00h 00h xxh 0xh 00h 00h 00h 00h 00h 00h FFh 0xh R/W R/W R/W R/W R/W R/W Read Only R/W R/W R/W R/W R/W 00h 00h R/W R/W xxh xxh 00h 00h 00h 00h 00h 00h 00h R/W Read Only R/W Read Only Read Only R/W R/W R/W R/W Reset Status 00h1) 00h 40h E0h1) 00h 00h Remarks R/W R/W R/W R/W R/W R/W2)
Port A
Port B
ATCSR CNTRH CNTRL AUTORELOAD ATRH TIMER ATRL PWMCR PWM0CSR
ADC ITC CLOCKS SI
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Notes: 1. The contents of the I/O port DR registers are readable only in output configuration. In input configuration, the values of the I/O pins are returned instead of the DR register contents. 2. The bits associated with unavailable pins must always keep their reset value.
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ST7L05, ST7L09
4 FLASH PROGRAM MEMORY
4.1 INTRODUCTION The ST7 single voltage extended Flash (XFlash) is a non-volatile memory that can be electrically erased and programmed either on a byte-by-byte basis or up to 32 bytes in parallel. The XFlash devices can be programmed off-board (plugged in a programming tool) or on-board using In-Circuit Programming or In-Application Programming. The array matrix organization allows each sector to be erased and reprogrammed without affecting other sectors. 4.2 MAIN FEATURES

ICP (In-Circuit Programming) IAP (In-Application Programming) ICT (In-Circuit Testing) for downloading and executing user application test patterns in RAM Sector 0 size configurable by option byte Read-out and write protection
4.3 PROGRAMMING MODES The ST7 can be programmed in three different ways: - Insertion in a programming tool. In this mode, Flash sectors 0 and 1, option byte row and data EEPROM can be programmed or erased. - In-Circuit Programming. In this mode, Flash sectors 0 and 1, option byte row and data EEPROM can be programmed or erased without removing the device from the application board. - In-Application Programming. In this mode, sector 1 and data EEPROM can be programmed or erased without removing the device from the application board and while the application is running.
4.3.1 In-Circuit Programming (ICP) ICP uses a protocol called ICC (In-Circuit Communication) which allows an ST7 plugged on a printed circuit board (PCB) to communicate with an external programming device connected via cable. ICP is performed in three steps: 1. Switch the ST7 to ICC mode (In-Circuit Communications). This is done by driving a specific signal sequence on the ICCCLK/DATA pins while the RESET pin is pulled low. When the ST7 enters ICC mode, it fetches a specific RESET vector which points to the ST7 System Memory containing the ICC protocol routine. This routine enables the ST7 to receive bytes from the ICC interface. 2. Download ICP Driver code in RAM from the ICCDATA pin 3. Execute ICP Driver code in RAM to program the Flash memory Depending on the ICP Driver code downloaded in RAM, Flash memory programming can be fully customized (number of bytes to program, program locations, or selection of the serial communication interface for downloading). 4.3.2 In-Application Programming (IAP) This mode uses an IAP Driver program previously programmed in Sector 0 by the user (in ICP mode). This mode is fully controlled by user software, allowing it to adapt to the user application, (such as user-defined strategy for entering programming mode, choice of communications protocol used to fetch the data to be stored). IAP mode is used to program any memory areas except Sector 0, which is Write/Erase protected to allow recovery in case errors occur during the programming operation.
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FLASH PROGRAM MEMORY (Cont'd) 4.4 ICC INTERFACE ICP needs a minimum of four and up to six pins to be connected to the programming tool. These pins are: - RESET: device reset - VSS: device power supply ground - ICCCLK: ICC output serial clock pin - ICCDATA: ICC input serial data pin - CLKIN: main clock input for external source - VDD: application board power supply (optional, see Note 3) Notes: 1. If the ICCCLK or ICCDATA pins are only used as outputs in the application, no signal isolation is necessary. As soon as the Programming Tool is plugged to the board, even if an ICC session is not in progress, the ICCCLK and ICCDATA pins are not available for the application. If they are used as inputs by the application, isolation such as a serial resistor must be implemented in case another device forces the signal. Refer to the Programming Tool documentation for recommended resistor values. 2. During the ICP session, the programming tool must control the RESET pin. This can lead to conflicts between the programming tool and the application reset circuit if it drives more than 5mA at Figure 4. Typical ICC Interface
PROGRAMMING TOOL ICC CONNECTOR ICC Cable ICC CONNECTOR HE10 CONNECTOR TYPE OPTIONAL (See Note 4) APPLICATION BOARD
high level (push pull output or pull-up resistor <1K). A Schottky diode can be used to isolate the application RESET circuit in this case. When using a classical RC network with R>1K or a reset management IC with open drain output and pull-up resistor>1K, no additional components are needed. In all cases the user must ensure that no external reset is generated by the application during the ICC session. 3. The use of Pin 7 of the ICC connector depends on the Programming Tool architecture. This pin must be connected when using most ST Programming Tools (it is used to monitor the application power supply). Please refer to the Programming Tool Manual. 4. Pin 9 must be connected to the CLKIN pin of the ST7 when the clock is not available in the application or if the selected clock option is not programmed in the option byte. Caution: During normal operation, ICCCLK pin must be pulled- up, internally or externally (external pull-up of 10K mandatory in noisy environment). This is to avoid entering ICC mode unexpectedly during a reset. In the application, even if the pin is configured as output, any reset will put it back in input pull-up.
(See Note 3)
9 10
7 8
5 6
3 4
1 2
APPLICATION RESET SOURCE See Note 2
APPLICATION POWER SUPPLY
See Note 1 and Caution APPLICATION I/O See Note 1 CLKIN RESET ICCDATA ICCCLK VDD
ST7
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FLASH PROGRAM MEMORY (Cont'd) 4.5 MEMORY PROTECTION Two different types of memory protection exist: Read-out Protection and Write/Erase Protection, which are applied individually. 4.5.1 Read-out Protection Read-out protection, when selected provides a protection against program memory content extraction and against write access to Flash memory. Even if no protection is considered as totally unbreakable, the feature provides a very high level of protection for a general purpose microcontroller. Both program and data E2 memory are protected. In Flash devices, this protection is removed by reprogramming the option. In this case, both program and data E2 memory are automatically erased and the device is reprogrammed. Read-out protection selection depends on the device type: - In Flash devices it is enabled and removed through the FMP_R bit in the option byte. - In ROM devices it is enabled by mask option specified in the Option List. 4.5.2 Flash Write/Erase Protection Write/Erase protection, when set, makes it impossible to both overwrite and erase program memory. It does not apply to E2 data. Its purpose is to provide advanced security to applications and prevent any change being made to the memory content. Warning: Once set, Write/Erase protection can never be removed. A write-protected Flash device is no longer reprogrammable. Table 4. Flash Register Map and Reset Values
Address (Hex.) 002Fh Register Label FCSR Reset Value 7 6 5 4 3 2 OPT 0 1 LAT 0 0 PGM 0
Write/Erase protection is enabled through the FMP_W bit in the option byte. 4.6 RELATED DOCUMENTATION For details on Flash programming and ICC protocol, refer to the ST7 Flash Programming Reference Manual and to the ST7 ICC Protocol Reference Manual. REGISTER DESCRIPTION FLASH CONTROL/STATUS REGISTER (FCSR) Read/Write Reset Value: 000 0000 (00h) 1st RASS Key: 0101 0110 (56h) 2nd RASS Key: 1010 1110 (AEh)
7 0 0 0 0 0 OPT LAT 0 PGM
Note: This register is reserved for programming using ICP, IAP or other programming methods. It controls the XFlash programming and erasing operations. When an EPB or another programming tool is used (in socket or ICP mode), the RASS keys are sent automatically.
0
0
0
0
0
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5 DATA EEPROM
5.1 INTRODUCTION The Electrically Erasable Programmable Read Only Memory can be used as a non-volatile backup for storing data. Using the EEPROM requires a basic access protocol described in this chapter. 5.2 MAIN FEATURES

Up to 32 bytes programmed in the same cycle EEPROM mono-voltage (charge pump) Chained erase and programming cycles Internal control of the global programming cycle duration WAIT mode management Read-out protection

Figure 5. EEPROM Block Diagram
HIGH VOLTAGE PUMP
EECSR
0
0
0
0
0
0
E2LAT E2PGM
ADDRESS DECODER
4
ROW DECODER
EEPROM MEMORY MATRIX (1 ROW = 32 x 8 BITS)
128 DATA MULTIPLEXER 4
128 32 x 8 BITS DATA LATCHES
4
ADDRESS BUS
DATA BUS
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DATA EEPROM (Cont'd) 5.3 MEMORY ACCESS The Data EEPROM memory read/write access modes are controlled by the E2LAT bit of the EEPROM Control/Status register (EECSR). The flowchart in Figure 6 describes these different memory access modes. Read Operation (E2LAT = 0) The EEPROM can be read as a normal ROM location when the E2LAT bit of the EECSR register is cleared. On this device, Data EEPROM can also be used to execute machine code. Take care not to write to the Data EEPROM while executing from it. This would result in an unexpected code being executed. Write Operation (E2LAT = 1) To access the write mode, the E2LAT bit has to be set by software (the E2PGM bit remains cleared). When a write access to the EEPROM area occurs, Figure 6. Data EEPROM Programming Flowchart
READ MODE E2LAT = 0 E2PGM = 0 WRITE MODE E2LAT = 1 E2PGM = 0
the value is latched inside the 32 data latches according to its address. When PGM bit is set by the software, all the previous bytes written in the data latches (up to 32) are programmed in the EEPROM cells. The effective high address (row) is determined by the last EEPROM write sequence. To avoid wrong programming, the user must take care that all the bytes written between two programming sequences have the same high address: Only the five Least Significant Bits of the address can change. At the end of the programming cycle, the PGM and LAT bits are cleared simultaneously. Note: Care should be taken during the programming cycle. Writing to the same memory location will over-program the memory (logical AND between the two write access data result) because the data latches are only cleared at the end of the programming cycle and by the falling edge of the E2LAT bit. It is not possible to read the latched data. This note is illustrated by the Figure 8.
READ BYTES IN EEPROM AREA
WRITE UP TO 32 BYTES IN EEPROM AREA (with the same 11 MSB of the address)
START PROGRAMMING CYCLE E2LAT=1 E2PGM=1 (set by software)
0 CLEARED BY HARDWARE
E2LAT
1
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DATA EEPROM (Cont'd) Figure 7. Data E2PROM Write Operation
Row / Byte ROW DEFINITION 0 1 ... N Read operation impossible 0 1 2 3 ... 30 31 Physical Address
00h...1Fh 20h...3Fh Nx20h...Nx20h+1Fh
Read operation possible
Byte 1
Byte 2 PHASE 1
Byte 32
Programming cycle PHASE 2
Writing data latches E2LAT bit
Set by USER application
Waiting E2PGM and E2LAT to fall
Cleared by hardware
E2PGM bit
Note: If a programming cycle is interrupted (by RESET action), the integrity of the data in memory will not be guaranteed.
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DATA EEPROM (Cont'd) 5.4 POWER SAVING MODES Wait mode The DATA EEPROM can enter WAIT mode on execution of the WFI instruction of the microcontroller or when the microcontroller enters Active Halt mode.The DATA EEPROM will immediately enter this mode if there is no programming in progress, otherwise the DATA EEPROM will finish the cycle and then enter WAIT mode. Active Halt mode Refer to Wait mode. Halt mode The DATA EEPROM immediately enters HALT mode if the microcontroller executes the HALT instruction. Therefore the EEPROM will stop the function in progress, and data may be corrupted. 5.5 ACCESS ERROR HANDLING If a read access occurs while E2LAT = 1, then the data bus will not be driven. If a write access occurs while E2LAT = 0, then the data on the bus will not be latched. If a programming cycle is interrupted (by RESET action), the integrity of the data in memory will not be guaranteed. 5.6 DATA EEPROM READ-OUT PROTECTION The read-out protection is enabled through an option bit (see option byte section). When this option is selected, the programs and data stored in the EEPROM memory are protected against read-out (including a re-write protection). In Flash devices, when this protection is removed by reprogramming the Option Byte, the entire Program memory and EEPROM is first automatically erased. Note: Both Program Memory and data EEPROM are protected using the same option bit.
Figure 8. Data EEPROM Programming Cycle
READ OPERATION NOT POSSIBLE INTERNAL PROGRAMMING VOLTAGE ERASE CYCLE WRITE OF DATA LATCHES WRITE CYCLE READ OPERATION POSSIBLE
tPROG
LAT
PGM
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DATA EEPROM (Cont'd) 5.7 REGISTER DESCRIPTION EEPROM CONTROL/STATUS REGISTER (EECSR) Read/Write Reset Value: 0000 0000 (00h)
7 0 0 0 0 0 0 0 E2LAT E2PGM
Bits 7:2 = Reserved, forced by hardware to 0. Bit 1 = E2LAT Latch Access Transfer This bit is set by software. It is cleared by hardware at the end of the programming cycle. It can only be cleared by software if the E2PGM bit is cleared. 0: Read mode 1: Write mode Bit 0 = E2PGM Programming control and status This bit is set by software to begin the programming cycle. At the end of the programming cycle, this bit is cleared by hardware. 0: Programming finished or not yet started 1: Programming cycle is in progress Note: If the E2PGM bit is cleared during the programming cycle, the memory data is not guaranteed. Table 5. Data EEPROM Register Map and Reset Values
Address (Hex.) 0030h Register Label EECSR Reset Value 7 6 5 4 3 2 1 E2LAT 0 0 E2PGM 0
0
0
0
0
0
0
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6 CENTRAL PROCESSING UNIT
6.1 INTRODUCTION This CPU has a full 8-bit architecture and contains six internal registers allowing efficient 8-bit data manipulation. 6.2 MAIN FEATURES

63 basic instructions Fast 8-bit by 8-bit multiply 17 main addressing modes Two 8-bit index registers 16-bit stack pointer Low power modes Maskable hardware interrupts Non-maskable software interrupt
6.3 CPU REGISTERS The six CPU registers shown in Figure 9 are not present in the memory mapping and are accessed by specific instructions. Figure 9. CPU Registers
7 RESET VALUE = XXh 7 RESET VALUE = XXh 7 RESET VALUE = XXh 15 PCH 87 PCL 0 0 0 0
Accumulator (A) The Accumulator is an 8-bit general purpose register used to hold operands and the results of the arithmetic and logic calculations and to manipulate data. Index Registers (X and Y) In indexed addressing modes, these 8-bit registers are used to create either effective addresses or temporary storage areas for data manipulation. (The Cross-Assembler generates a precede instruction (PRE) to indicate that the following instruction refers to the Y register.) The Y register is not affected by the interrupt automatic procedures (not pushed to and popped from the stack). Program Counter (PC) The program counter is a 16-bit register containing the address of the next instruction to be executed by the CPU. It is made of two 8-bit registers PCL (Program Counter Low which is the LSB) and PCH (Program Counter High which is the MSB).
ACCUMULATOR
X INDEX REGISTER
Y INDEX REGISTER
PROGRAM COUNTER RESET VALUE = RESET VECTOR @ FFFEh-FFFFh 7 111HI 0 NZC CONDITION CODE REGISTER
RESET VALUE = 1 1 1 X 1 X X X 15 87 0 STACK POINTER RESET VALUE = STACK HIGHER ADDRESS X = Undefined Value
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CPU REGISTERS (Cont'd) CONDITION CODE REGISTER (CC) Read/Write Reset Value: 111x1xxx
7 1 1 1 H I N Z 0 C
because the I bit is set by hardware at the start of the routine and reset by the IRET instruction at the end of the routine. If the I bit is cleared by software in the interrupt routine, pending interrupts are serviced regardless of the priority level of the current interrupt routine. Bit 2 = N Negative This bit is set and cleared by hardware. It is representative of the result sign of the last arithmetic, logical or data manipulation. It is a copy of the 7th bit of the result. 0: The result of the last operation is positive or null. 1: The result of the last operation is negative (that is, the most significant bit is a logic 1). This bit is accessed by the JRMI and JRPL instructions. Bit 1 = Z Zero This bit is set and cleared by hardware. This bit indicates that the result of the last arithmetic, logical or data manipulation is zero. 0: The result of the last operation is different from zero. 1: The result of the last operation is zero. This bit is accessed by the JREQ and JRNE test instructions. Bit 0 = C Carry/borrow This bit is set and cleared by hardware and software. It indicates an overflow or an underflow has occurred during the last arithmetic operation. 0: No overflow or underflow has occurred. 1: An overflow or underflow has occurred. This bit is driven by the SCF and RCF instructions and tested by the JRC and JRNC instructions. It is also affected by the "bit test and branch", shift and rotate instructions.
The 8-bit Condition Code register contains the interrupt mask and four flags representative of the result of the instruction just executed. This register can also be handled by the PUSH and POP instructions. These bits can be individually tested and/or controlled by specific instructions. Bit 4 = H Half carry This bit is set by hardware when a carry occurs between bits 3 and 4 of the ALU during an ADD or ADC instruction. It is reset by hardware during the same instructions. 0: No half carry has occurred. 1: A half carry has occurred. This bit is tested using the JRH or JRNH instruction. The H bit is useful in BCD arithmetic subroutines. Bit 3 = I Interrupt mask This bit is set by hardware when entering in interrupt or by software to disable all interrupts except the TRAP software interrupt. This bit is cleared by software. 0: Interrupts are enabled. 1: Interrupts are disabled. This bit is controlled by the RIM, SIM and IRET instructions and is tested by the JRM and JRNM instructions. Note: Interrupts requested while I is set are latched and can be processed when I is cleared. By default an interrupt routine is not interruptible
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CPU REGISTERS (Cont'd) Stack Pointer (SP) Read/Write Reset Value: 00 FFh
15 0 7 1 1 SP5 SP4 SP3 SP2 SP1 0 0 0 0 0 0 8 0 0 SP0
The Stack Pointer is a 16-bit register which is always pointing to the next free location in the stack. It is then decremented after data has been pushed onto the stack and incremented before data is popped from the stack (see Figure 10). Since the stack is 64 bytes deep, the 10 most significant bits are forced by hardware. Following an MCU Reset, or after a Reset Stack Pointer instruction (RSP), the Stack Pointer contains its reset value (the SP5 to SP0 bits are set) which is the stack higher address. Figure 10. Stack Manipulation Example
CALL Subroutine @ 00C0h Interrupt event PUSH Y
The least significant byte of the Stack Pointer (called S) is directly accessed by an LD instruction. Note: When the lower limit is exceeded, the Stack Pointer wraps around to the stack upper limit, without indicating the stack overflow. The previously stored information is then overwritten and therefore lost. The stack also wraps in case of an underflow. The stack is used to save the return address during a subroutine call and the CPU context during an interrupt. The user may also directly manipulate the stack by means of the PUSH and POP instructions. In the case of an interrupt, the PCL is stored at the first location pointed to by the SP. Then the other registers are stored in the next locations as shown in Figure 10. - When an interrupt is received, the SP is decremented and the context is pushed on the stack. - On return from interrupt, the SP is incremented and the context is popped from the stack. A subroutine call occupies two locations and an interrupt five locations in the stack area.
POP Y
IRET
RET or RSP
SP SP CC A X PCH SP PCH @ 00FFh PCL PCL PCH PCL Y CC A X PCH PCL PCH PCL SP CC A X PCH PCL PCH PCL SP PCH PCL SP
Stack Higher Address = 00FFh Stack Lower Address = 00C0h
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7 SUPPLY, RESET AND CLOCK MANAGEMENT
The device includes a range of utility features for securing the application in critical situations (for example in case of a power brown-out), and reducing the number of external components. Main features
Clock Management - 1 MHz internal RC oscillator (enabled by option byte) - External Clock Input (enabled by option byte) - PLL for multiplying the frequency by 8 Reset Sequence Manager (RSM)
- RCCR0 and RCCR1 calibration values are erased if the read-out protection bit is reset after it has been set. See "Read-out Protection" on page 14. Caution: If the voltage or temperature conditions change in the application, the frequency may require recalibration. Refer to application note AN1324 for information on how to calibrate the RC frequency using an external reference signal. 7.2 PHASE LOCKED LOOP The PLL is used to multiply a 1 MHz frequency from the RC oscillator or the external clock by 8 to obtain fOSC of 8 MHz. The PLL is enabled (by 1 option bit) and the multiplication factor is 8. The x8 PLL is intended for operation with VDD in the 3.6 to 5.5V range Refer to Section 15.2 for the option byte description. If the PLL is disabled and the RC oscillator is enabled, then fOSC = 1 MHz. If both the RC oscillator and the PLL are disabled, fOSC is driven by the external clock. Figure 11. PLL Output Frequency Timing Diagram LOCKED bit set 8x input freq. tSTAB
7.1 INTERNAL RC OSCILLATOR ADJUSTMENT The ST7 contains an internal RC oscillator with an accuracy of 1% for a given device, temperature and voltage. It must be calibrated to obtain the frequency required in the application. This is done by software writing a calibration value in the RCCR (RC Control Register). Whenever the microcontroller is reset, the RCCR returns to its default value (FFh), that is, each time the device is reset, the calibration value must be loaded in the RCCR. The predefined calibration value is stored in EEPROM for 5V VDD supply voltage at 25C, as shown in the following table.
ST7FL09 Address 1000h and FFDEh 1001h and FFDFh ST7FL05 Address FFDEh
RCCR RCCR0
Conditions VDD = 5V TA = 25C fRC = 1 MHz VDD = 3.3V TA = 25C fRC = 700 kHz
Output freq.
tLOCK tSTARTUP
RCCR1
FFDFh
Notes: - See "ELECTRICAL CHARACTERISTICS" on page 73. for more information on the frequency and accuracy of the RC oscillator. - To improve clock stability and frequency accuracy, it is recommended to place a decoupling capacitor, typically 100nF, between the VDD and VSS pins as close as possible to the ST7 device. - This byte is systematically programmed by ST, including on FASTROM devices. Consequently, customers intending to use FASTROM service must not use this byte.
t When the PLL is started, after reset or wakeup from Halt mode or AWUFH mode, it outputs the clock after a delay of tSTARTUP. When the PLL output signal reaches the operating frequency, the LOCKED bit in the SICSCR register is set. Full PLL accuracy (ACCPLL) is reached after a stabilization time of tSTAB (see Figure 11 and section 13.3.2 Internal RC Oscillator and PLL).
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SUPPLY, RESET AND CLOCK MANAGEMENT (Cont'd) 7.3 REGISTER DESCRIPTION MAIN CLOCK CONTROL/STATUS REGISTER (MCCSR) Read / Write Reset Value: 0000 0000 (00h)
7 0 0 0 0 0 0
MCO
0
SMS
Bits 7:0 = CR[7:0] RC Oscillator Frequency Adjustment Bits These bits must be written immediately after reset to adjust the RC oscillator frequency and to obtain an accuracy of 1%. The application can store the correct value for each voltage range in EEPROM and write it to this register at start-up. 00h = maximum available frequency FFh = lowest available frequency Note: To tune the oscillator, write a series of different values in the register until the correct frequency is reached. The fastest method is to use a dichotomy starting with 80h. SYSTEM INTEGRITY (SI) CONTROL/STATUS REGISTER (SICSR) Read/Write Reset Value: 0000 0x00 (0xh)
7 0 0 0 0
LOCK ED 0 0 0
Bits 7:2 = Reserved, must be kept cleared. Bit 1 = MCO Main Clock Out enable This bit is read/write by software and cleared by hardware after a reset. This bit allows to enable the MCO output clock. 0: MCO clock disabled, I/O port free for general purpose I/O. 1: MCO clock enabled.
Bit 0 = SMS Slow Mode select This bit is read/write by software and cleared by hardware after a reset. This bit selects the input clock fOSC or fOSC/32. 0: Normal mode (fCPU = fOSC) 1: Slow mode (fCPU = fOSC/32)
0
Bits 7:4 = Reserved, must be kept cleared. Bit 3 = LOCKED PLL Locked Flag This bit is set and cleared by hardware. It is set automatically when the PLL reaches its operating frequency. 0: PLL not locked 1: PLL locked Bits 2:0 = Reserved, must be kept cleared.
RC CONTROL REGISTER (RCCR) Read / Write Reset Value: 1111 1111 (FFh)
7 CR7 CR6 CR5 CR4 CR3 CR2 CR1 0 CR0
Table 6. Clock Register Map and Reset Values
Address (Hex.) 0038h 0039h 003Ah Register Label MCCSR Reset Value RCCR Reset Value SICSR Reset Value 0 CR7 1 0 0 CR6 1 0 0 CR5 1 0 0 CR4 1 0 0 CR3 1 LOCKED 0 0 CR2 1 0 7 6 5 4 3 2 1 MCO 0 CR1 1 0 0 SMS 0 CR0 1 0
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SUPPLY, RESET AND CLOCK MANAGEMENT (Cont'd)
Figure 12. Clock Management Block Diagram
CR7
CR6
CR5
CR4
CR3
CR2
CR1
CR0
RCCR 1 MHz
Tunable 1% RC Oscillator
PLL 1 MHz -> 8 MHz
8 MHz
fOSC
Option byte CLKIN /2 DIVIDER
0 to 8 MHz
Option byte
8-bit LITE TIMER COUNTER fOSC fOSC/32 1
fLTIMER (1ms timebase @ 8 MHz fOSC)
/32 DIVIDER
fCPU fOSC 0 TO CPU AND PERIPHERALS (except LITE TIMER)
MCO SMS MCCSR
7
0
fCPU
MCO
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SUPPLY, RESET AND CLOCK MANAGEMENT (Cont'd) 7.4 RESET SEQUENCE MANAGER (RSM) 7.4.1 Introduction The reset sequence manager includes two RESET sources as shown in Figure 14: External RESET source pulse Internal WATCHDOG RESET Note: A reset can also be triggered following the detection of an illegal opcode or prebyte code. Refer to Section 12.2.1 on page 70 for further details. These sources act on the RESET pin and it is always kept low during the delay phase. The RESET service routine vector is fixed at addresses FFFEh-FFFFh in the ST7 memory map. The basic RESET sequence consists of three phases as shown in Figure 13: Active Phase depending on the RESET source 256 CPU clock cycle delay RESET vector fetch Caution: When the ST7 is unprogrammed or fully erased, the Flash is blank and the RESET vector is not programmed. For this reason, it is recommended to keep the RESET pin in low state until Figure 14. ST7L0x Reset Block Diagram
VDD
programming mode is entered, in order to avoidunwanted behavior. The 256 CPU clock cycle delay allows the oscillator to stabilize and ensures that recovery has taken place from the Reset state. The RESET vector fetch phase duration is two clock cycles. If the PLL is enabled by option byte, it outputs the clock after an additional delay of tSTARTUP (see Figure 11). Figure 13. RESET Sequence Phases
RESET
Active Phase INTERNAL RESET 256 CLOCK CYCLES FETCH VECTOR
RON
RESET
FILTER INTERNAL RESET
PULSE GENERATOR
WATCHDOG RESET ILLEGAL OPCODE RESET1)
Note 1: See "Illegal Opcode Reset" on page 70. for more details on illegal opcode reset conditions.
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SUPPLY, RESET AND CLOCK MANAGEMENT (Cont'd) 7.4.2 Asynchronous External RESET Pin The RESET pin is both an input and an open-drain output with integrated RON weak pull-up resistor. This pull-up has no fixed value but varies in accordance with the input voltage. It is pulled low by external circuitry to reset the device. See Electrical Characteristics section for more details. A RESET signal originating from an external source must have a duration of at least th(RSTL)in in order to be recognized. This detection is asynchronous and therefore the MCU can enter reset state even in HALT mode. The RESET pin is an asynchronous signal which plays a major role in EMS performance. In a noisy environment, it is recommended to follow the guidelines mentioned in the electrical characteristics section. 7.4.3 External Power-On RESET To start up the microcontroller correctly, the user must ensure by means of an external reset circuit that the reset signal is held low until VDD is over the minimum level specified for the selected fOSC frequency. A proper reset signal for a slow rising VDD supply can generally be provided by an external RC network connected to the RESET pin. 7.4.4 Internal Watchdog RESET A RESET sequence is generated by a internal Watchdog counter overflow. Starting from the Watchdog counter underflow, the device RESET pin acts as an output that is pulled low during at least tw(RSTL)out.
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8 INTERRUPTS
The ST7 core may be interrupted by one of two different methods: Maskable hardware interrupts as listed in Table 7, "Interrupt Mapping," on page 29 and a non-maskable software interrupt (TRAP). The Interrupt processing flowchart is shown in Figure 15. The maskable interrupts must be enabled by clearing the I bit in order to be serviced. However, disabled interrupts may be latched and processed when they are enabled (see external interrupts subsection). Note: After reset, all interrupts are disabled. When an interrupt has to be serviced: - Normal processing is suspended at the end of the current instruction execution. - The PC, X, A and CC registers are saved onto the stack. - The I bit of the CC register is set to prevent additional interrupts. - The PC is then loaded with the interrupt vector of the interrupt to service and the first instruction of the interrupt service routine is fetched (refer to the Interrupt Mapping table for vector addresses). The interrupt service routine should finish with the IRET instruction which causes the contents of the saved registers to be recovered from the stack. Note: As a consequence of the IRET instruction, the I bit is cleared and the main program resumes. Priority Management By default, a servicing interrupt cannot be interrupted because the I bit is set by hardware entering in interrupt routine. In the case when several interrupts are simultaneously pending, an hardware priority defines which one will be serviced first (see the Interrupt Mapping table). Interrupts and Low Power Mode All interrupts allow the processor to leave the WAIT low power mode. Only external and specifically mentioned interrupts allow the processor to leave the HALT low power mode (refer to the "Exit from HALT" column in the Interrupt Mapping table). 8.1 NON-MASKABLE SOFTWARE INTERRUPT This interrupt is entered when the TRAP instruction is executed regardless of the state of the I bit. It is serviced according to the flowchart in Figure 15. 8.2 EXTERNAL INTERRUPTS External interrupt vectors can be loaded into the PC register if the corresponding external interrupt occurred and if the I bit is cleared. These interrupts allow the processor to leave the HALT low power mode. The external interrupt polarity is selected through the miscellaneous register or interrupt register (if available). An external interrupt triggered on edge will be latched and the interrupt request automatically cleared upon entering the interrupt service routine. Caution: The type of sensitivity defined in the Miscellaneous or Interrupt register (if available) applies to the ei source. In case of a NANDed source (as described in the I/O ports section), a low level on an I/O pin, configured as input with interrupt, masks the interrupt request even in case of risingedge sensitivity. 8.3 PERIPHERAL INTERRUPTS Different peripheral interrupt flags in the status register are able to cause an interrupt when they are active if both: - The I bit of the CC register is cleared. - The corresponding enable bit is set in the control register. If any of these two conditions is false, the interrupt is latched and thus remains pending. Clearing an interrupt request is done by: - Writing "0" to the corresponding bit in the status register or - Access to the status register while the flag is set followed by a read or write of an associated register. Note: The clearing sequence resets the internal latch. A pending interrupt (that is, waiting for being enabled) will therefore be lost if the clear sequence is executed.
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INTERRUPTS (Cont'd) Figure 15. Interrupt Processing Flowchart
FROM RESET I BIT SET? Y N
N
INTERRUPT PENDING? Y
FETCH NEXT INSTRUCTION
N
IRET? Y
STACK PC, X, A, CC SET I BIT LOAD PC FROM INTERRUPT VECTOR
EXECUTE INSTRUCTION
RESTORE PC, X, A, CC FROM STACK THIS CLEARS I BIT BY DEFAULT
Table 7. Interrupt Mapping
N Source Block RESET TRAP 0 1 2 3 4 5 6 7 8 9 10 11 12 13 AT TIMER LITE TIMER SPI ei0 ei1 ei2 ei3 Reset Software Interrupt Not used External Interrupt 0 External Interrupt 1 External Interrupt 2 External Interrupt 3 Not used Not used Not used AT TIMER Output Compare Interrupt AT TIMER Overflow Interrupt LITE TIMER Input Capture Interrupt LITE TIMER RTC Interrupt SPI Peripheral Interrupts Not used PWM0CSR ATCSR LTCSR LTCSR SPICSR Lowest Priority no yes no yes yes N/A yes Description Register Label Priority Order Highest Priority Exit from HALT yes no Address Vector FFFEh-FFFFh FFFCh-FFFDh FFFAh-FFFBh FFF8h-FFF9h FFF6h-FFF7h FFF4h-FFF5h FFF2h-FFF3h FFF0h-FFF1h FFEEh-FFEFh FFECh-FFEDh FFEAh-FFEBh FFE8h-FFE9h FFE6h-FFE7h FFE4h-FFE5h FFE2h-FFE3h FFE0h-FFE1h
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INTERRUPTS (Cont'd) EXTERNAL INTERRUPT CONTROL REGISTER (EICR) Read/Write Reset Value: 0000 0000 (00h)
7 IS31 IS30 IS21 IS20 IS11 IS10 IS01 0 IS00
Bits 1:0 = IS0[1:0] ei0 sensitivity These bits define the interrupt sensitivity for ei0 (Port A0) according to Table 8. Note: These 8 bits can be written only when the I bit in the CC register is set. Table 8. Interrupt Sensitivity Bits
ISx1 ISx0 0 1 0 1 External Interrupt Sensitivity Falling edge & low level Rising edge only Falling edge only Rising and falling edge
Bits 7:6 = IS3[1:0] ei3 sensitivity These bits define the interrupt sensitivity for ei3 (Port B0) according to Table 8. Bits 5:4 = IS2[1:0] ei2 sensitivity These bits define the interrupt sensitivity for ei2 (Port B3) according to Table 8. Bits 3:2 = IS1[1:0] ei1 sensitivity These bits define the interrupt sensitivity for ei1 (Port A7) according to Table 8.
0 0 1 1
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9 POWER SAVING MODES
9.1 INTRODUCTION To give a large measure of flexibility to the application in terms of power consumption, four main power saving modes are implemented in the ST7 (see Figure 16): SLOW, WAIT (SLOW WAIT), ACTIVE HALT and HALT. After a RESET the normal operating mode is selected by default (RUN mode). This mode drives the device (CPU and embedded peripherals) by means of a master clock which is based on the main oscillator frequency (fOSC). From RUN mode, the different power saving modes may be selected by setting the relevant register bits or by calling the specific ST7 software instruction whose action depends on the oscillator status. Figure 16. Power Saving Mode Transitions
High RUN
fOSC/32 fOSC
9.2 SLOW MODE This mode has two targets: - To reduce power consumption by decreasing the internal clock in the device, - To adapt the internal clock frequency (fCPU) to the available supply voltage. SLOW mode is controlled by the SMS bit in the MCCSR register which enables or disables Slow mode. In this mode, the oscillator frequency is divided by 32. The CPU and peripherals are clocked at this lower frequency. Notes: SLOW-WAIT mode is activated when entering WAIT mode while the device is already in SLOW mode. SLOW mode has no effect on the Lite Timer which is already clocked at fOSC/32. Figure 17. SLOW Mode Clock Transition
SLOW WAIT SLOW WAIT ACTIVE HALT HALT Low POWER CONSUMPTION
fCPU
fOSC
SMS
NORMAL RUN MODE REQUEST
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POWER SAVING MODES (Cont'd) 9.3 WAIT MODE WAIT mode places the MCU in a low power consumption mode by stopping the CPU. This power saving mode is selected by calling the `WFI' instruction. All peripherals remain active. During WAIT mode, the I bit of the CC register is cleared, to enable all interrupts. All other registers and memory remain unchanged. The MCU remains in WAIT mode until an interrupt or RESET occurs, whereupon the Program Counter branches to the starting address of the interrupt or reset service routine. The MCU will remain in WAIT mode until a Reset or an Interrupt occurs, causing it to wake up. Refer to Figure 18. Figure 18. WAIT Mode Flowchart
OSCILLATOR PERIPHERALS CPU I BIT ON ON OFF 0
WFI INSTRUCTION
N RESET N INTERRUPT Y OSCILLATOR PERIPHERALS CPU I BIT ON OFF ON 0 Y
256 CPU CLOCK CYCLE DELAY
OSCILLATOR PERIPHERALS CPU I BIT
ON ON ON X1)
FETCH RESET VECTOR OR SERVICE INTERRUPT Notes: 1. Before servicing an interrupt, the CC register is pushed on the stack. The I bit of the CC register is set during the interrupt routine and cleared when the CC register is popped.
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POWER SAVING MODES (Cont'd) 9.4 ACTIVE HALT AND HALT MODES ACTIVE HALT and HALT modes are the two lowest power consumption modes of the MCU. They are both entered by executing the `HALT' instruction. The decision to enter either in ACTIVE HALT or HALT mode is given by the LTCSR/ATCSR register status as shown in the following table:
ATCSR ATCSR ATCSR LTCSR OVFIE CK1 bit CK0 bit TBIE bit bit 0 0 0 1 x x 0 1 x 1 x x 1 x 0 0 x 1 x 1 ACTIVE HALT mode enabled HALT INSTRUCTION (Active Halt enabled) ACTIVE HALT mode disabled Meaning
Figure 19. ACTIVE HALT Timing Overview
RUN ACTIVE HALT 256 CPU CYCLE DELAY1) RUN
RESET OR HALT INTERRUPT INSTRUCTION [Active Halt Enabled]
FETCH VECTOR
Figure 20. ACTIVE HALT Mode Flowchart
OSCILLATOR ON PERIPHERALS 2) OFF CPU OFF I BIT 0
9.4.1 ACTIVE HALT Mode ACTIVE HALT mode is the lowest power consumption mode of the MCU with a real time clock available. It is entered by executing the `HALT' instruction when active halt mode is enabled. The MCU can exit ACTIVE HALT mode on reception of a Lite Timer / AT Timer interrupt or a RESET. - When exiting ACTIVE HALT mode by means of a RESET, a 256 CPU cycle delay occurs. After the start up delay, the CPU resumes operation by fetching the reset vector which woke it up (see Figure 20). - When exiting ACTIVE HALT mode by means of an interrupt, the CPU immediately resumes operation by servicing the interrupt vector which woke it up (see Figure 20). When entering ACTIVE HALT mode, the I bit in the CC register is cleared to enable interrupts. Therefore, if an interrupt is pending, the MCU wakes up immediately. In ACTIVE HALT mode, only the main oscillator and the selected timer counter (LT/AT) are running to keep a wake-up time base. All other peripherals are not clocked except those which get their clock supply from another clock generator (such as external or auxiliary oscillator). Caution: As soon as ACTIVE HALT is enabled, executing a HALT instruction while the Watchdog is active does not generate a RESET if the WDGHALT bit is reset. This means that the device cannot spend more than a defined delay in this power saving mode.
N RESET N Y INTERRUPT 3) Y OSCILLATOR ON PERIPHERALS 2) OFF CPU ON I BIT X 4) 256 CPU CLOCK CYCLE DELAY OSCILLATOR PERIPHERALS CPU I BITS ON ON ON X 4)
FETCH RESET VECTOR OR SERVICE INTERRUPT Notes: 1. This delay occurs only if the MCU exits ACTIVE HALT mode by means of a RESET. 2. Peripherals clocked with an external clock source can still be active. 3. Only the Lite Timer RTC and AT Timer interrupts can exit the MCU from ACTIVE HALT mode. 4. Before servicing an interrupt, the CC register is pushed on the stack. The I bit of the CC register is set during the interrupt routine and cleared when the CC register is popped.
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POWER SAVING MODES (Cont'd) 9.4.2 HALT Mode The HALT mode is the lowest power consumption mode of the MCU. It is entered by executing the `HALT' instruction when active halt mode is disabled. The MCU can exit HALT mode on reception of either a specific interrupt (see Table 7, "Interrupt Mapping," on page 29) or a RESET. When exiting HALT mode by means of a RESET or an interrupt, the oscillator is immediately turned on and the 256 CPU cycle delay is used to stabilize the oscillator. After the start up delay, the CPU resumes operation by servicing the interrupt or by fetching the reset vector which woke it up (see Figure 22). When entering HALT mode, the I bit in the CC register is forced to 0 to enable interrupts. Therefore, if an interrupt is pending, the MCU wakes immediately. In HALT mode, the main oscillator is turned off causing all internal processing to stop, including the operation of the on-chip peripherals. All peripherals are not clocked except the ones which get their clock supply from another clock generator (such as an external or auxiliary oscillator). The compatibility of Watchdog operation with HALT mode is configured by the "WDGHALT" option bit of the option byte. The HALT instruction when executed while the Watchdog system is enabled, can generate a Watchdog RESET (see Section 15.2 on page 96 for more details). Figure 21. HALT Timing Overview
RUN HALT 256 CPU CYCLE DELAY RESET OR INTERRUPT FETCH VECTOR RUN FETCH RESET VECTOR OR SERVICE INTERRUPT Notes: 1. WDGHALT is an option bit. See option byte section for more details. 2. Peripheral clocked with an external clock source can still be active. 3. Only some specific interrupts can exit the MCU from HALT mode (such as external interrupt). Refer to Table 7, "Interrupt Mapping," on page 29 for more details. 4. Before servicing an interrupt, the CC register is pushed on the stack. The I bit of the CC register is set during the interrupt routine and cleared when the CC register is popped. 5. If the PLL is enabled by option byte, it outputs the clock after a delay of tSTARTUP (see Figure 11).
Figure 22. HALT Mode Flowchart
HALT INSTRUCTION (Active Halt disabled) ENABLE WDGHALT1) 1 WATCHDOG RESET OSCILLATOR OFF PERIPHERALS2) OFF CPU OFF I BIT 0 N RESET N Y INTERRUPT3) Y OSCILLATOR PERIPHERALS CPU I BIT ON OFF ON X4) 0 WATCHDOG DISABLE
256 CPU CLOCK CYCLE DELAY OSCILLATOR PERIPHERALS CPU I BITS ON ON ON X4)
HALT INSTRUCTION [Active Halt disabled]
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POWER SAVING MODES (Cont'd) 9.4.2.1 HALT Mode Recommendations - Make sure that an external event is available to wake up the microcontroller from Halt mode. - When using an external interrupt to wake up the microcontroller, reinitialize the corresponding I/O as "Input Pull-up with Interrupt" before executing the HALT instruction. The main reason for this is that the I/O may be wrongly configured due to external interference or by an unforeseen logical condition. - For the same reason, reinitialize the level sensitiveness of each external interrupt as a precautionary measure. - The opcode for the HALT instruction is 0x8E. To avoid an unexpected HALT instruction due to a program counter failure, it is advised to clear all occurrences of the data value 0x8E from memory. For example, avoid defining a constant in ROM with the value 0x8E. - As the HALT instruction clears the I bit in the CC register to allow interrupts, the user may choose to clear all pending interrupt bits before executing the HALT instruction. This avoids entering other peripheral interrupt routines after executing the external interrupt routine corresponding to the wake-up event (reset or external interrupt).
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10 I/O PORTS
10.1 INTRODUCTION The I/O ports offer different functional modes: - transfer of data through digital inputs and outputs and for specific pins: - external interrupt generation - alternate signal input/output for the on-chip peripherals. An I/O port contains up to eight pins. Each pin can be programmed independently as digital input (with or without interrupt generation) or digital output. 10.2 FUNCTIONAL DESCRIPTION Each port has two main registers: - Data Register (DR) - Data Direction Register (DDR) and one optional register: - Option Register (OR) Each I/O pin may be programmed using the corresponding register bits in the DDR and OR registers: bit X corresponding to pin X of the port. The same correspondence is used for the DR register. The following description takes into account the OR register, (for specific ports which do not provide this register refer to the I/O Port Implementation section). The generic I/O block diagram is shown in Figure 23 10.2.1 Input Modes The input configuration is selected by clearing the corresponding DDR register bit. In this case, reading the DR register returns the digital value applied to the external I/O pin. Different input modes can be selected by software through the OR register. Note: Writing the DR register modifies the latch value but does not affect the pin status. External interrupt function When an I/O is configured as Input with Interrupt, an event on this I/O can generate an external interrupt request to the CPU. Each pin can independently generate an interrupt request. The interrupt sensitivity is independently programmable using the sensitivity bits in the EICR register. Each external interrupt vector is linked to a dedicated group of I/O port pins (see pinout description and interrupt section). If several input pins are selected simultaneously as interrupt source, these are logically ANDed. For this reason if one of the interrupt pins is tied low, it may mask the others. External interrupts are hardware interrupts. Fetching the corresponding interrupt vector automatically clears the request latch. Changing the sensitivity of a particular external interrupt clears this pending interrupt. This can be used to clear unwanted pending interrupts. Spurious interrupts When enabling/disabling an external interrupt by setting/resetting the related OR register bit, a spurious interrupt is generated if the pin level is low and its edge sensitivity includes falling/rising edge. This is due to the edge detector input which is switched to '1' when the external interrupt is disabled by the OR register. To avoid this unwanted interrupt, a "safe" edge sensitivity (rising edge for enabling and falling edge for disabling) has to be selected before changing the OR register bit and configuring the appropriate sensitivity again. Caution: In case a pin level change occurs during these operations (asynchronous signal input), as interrupts are generated according to the current sensitivity, it is advised to disable all interrupts before and to re-enable them after the complete previous sequence in order to avoid an external interrupt occurring on the unwanted edge. This corresponds to the following steps: 1. To enable an external interrupt: - set the interrupt mask with the SIM instruction (in cases where a pin level change could occur) - select rising edge - enable the external interrupt through the OR register - select the desired sensitivity if different from rising edge - reset the interrupt mask with the RIM instruction (in cases where a pin level change could occur) 2. To disable an external interrupt: - set the interrupt mask with the SIM instruction SIM (in cases where a pin level change could occur) - select falling edge - disable the external interrupt through the OR
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register - select rising edge reset the interrupt mask with the RIM instruction (in cases where a pin level change could occur) 10.2.2 Output Modes The output configuration is selected by setting the corresponding DDR register bit. In this case, writing the DR register applies this digital value to the I/O pin through the latch. Then reading the DR register returns the previously stored value. Two different output modes can be selected by software through the OR register: Output push-pull and open-drain. DR register value and output pin status:
DR 0 1 Push-pull VSS VDD Open-drain Vss Floating
Note: When switching from input to output mode, the DR register must be written first to drive the correct level on the pin as soon as the port is configured as an output.
10.2.3 Alternate Functions When an on-chip peripheral is configured to use a pin, the alternate function is automatically selected. This alternate function takes priority over the standard I/O programming under the following conditions: - When the signal is coming from an on-chip peripheral, the I/O pin is automatically configured in output mode (push-pull or open drain according to the peripheral). - When the signal is going to an on-chip peripheral, the I/O pin must be configured in floating input mode. In this case, the pin state is also digitally readable by addressing the DR register. Notes: - Input pull-up configuration can cause unexpected value at the input of the alternate peripheral input. - When an on-chip peripheral uses a pin as input and output, this pin must be configured in input floating mode.
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I/O PORTS (Cont'd) Figure 23. I/O Port General Block Diagram
REGISTER ACCESS ALTERNATE OUTPUT 1 0 ALTERNATE ENABLE DR VDD P-BUFFER (see table below) PULL-UP (see table below) VDD
DDR PULL-UP CONDITION If implemented OR SEL N-BUFFER DDR SEL CMOS SCHMITT TRIGGER ANALOG INPUT DIODES (see table below) PAD
OR
EXTERNAL INTERRUPT SOURCE (eix)
Table 9. I/O Port Mode Options
Configuration Mode Input Output Floating with/without Interrupt Pull-up with/without Interrupt Push-pull Open Drain (logic level) Pull-Up Off On Off P-Buffer Off On Off On On Diodes to VDD to VSS
Legend: NI - not implemented Off - implemented not activated On - implemented and activated
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DATA BUS
DR SEL
1 0
ALTERNATE INPUT FROM OTHER BITS
POLARITY SELECTION
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I/O PORTS (Cont'd) Table 10. I/O Port Configurations
Hardware Configuration
VDD RPU PAD PULL-UP CONDITION DR REGISTER ACCESS
DR REGISTER
W DATA BUS R
INPUT 1)
ALTERNATE INPUT FROM OTHER PINS INTERRUPT CONDITION POLARITY SELECTION ANALOG INPUT EXTERNAL INTERRUPT SOURCE (eix)
OPEN-DRAIN OUTPUT 2)
VDD RPU PAD
DR REGISTER ACCESS
DR REGISTER
R/W
DATA BUS
ALTERNATE ENABLE
ALTERNATE OUTPUT
PUSH-PULL OUTPUT 2)
VDD RPU PAD
DR REGISTER ACCESS
DR REGISTER
R/W
DATA BUS
ALTERNATE ENABLE
ALTERNATE OUTPUT
Notes: 1. When the I/O port is in input configuration and the associated alternate function is enabled as an output, reading the DR register will read the alternate function output status. 2. When the I/O port is in output configuration and the associated alternate function is enabled as an input, the alternate function reads the pin status given by the DR register content.
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I/O PORTS (Cont'd) Caution: The alternate function must not be activated as long as the pin is configured as input with interrupt, in order to avoid generating spurious interrupts. Analog alternate function When the pin is used as an ADC input, the I/O must be configured as floating input. The analog multiplexer (controlled by the ADC registers) switches the analog voltage present on the selected pin to the common analog rail which is connected to the ADC input. It is recommended not to change the voltage level or loading on any port pin while conversion is in progress. Furthermore it is recommended not to have clocking pins located close to a selected analog pin. WARNING: The analog input voltage level must be within the limits stated in the absolute maximum ratings. 10.3 UNUSED I/O PINS Unused I/O pins must be connected to fixed voltage levels. Refer to Section 13.8. 10.4 LOW POWER MODES
Mode WAIT HALT Description No effect on I/O ports. External interrupts cause the device to exit from WAIT mode. No effect on I/O ports. External interrupts cause the device to exit from HALT mode. 01 00 10 OUTPUT open-drain 11 OUTPUT push-pull INPUT INPUT floating/pull-up floating interrupt (reset state)
10.5 INTERRUPTS The external interrupt event generates an interrupt if the corresponding configuration is selected with DDR and OR registers and the interrupt mask in the CC register is not active (RIM instruction).
Interrupt Event External interrupt on selected external event Enable Event Control Flag Bit DDRx ORx Exit from Wait Yes Exit from Halt Yes
10.6 I/O PORT IMPLEMENTATION The hardware implementation on each I/O port depends on the settings in the DDR and OR registers and specific feature of the I/O port such as ADC Input. Switching these I/O ports from one state to another must be done in a sequence that prevents unwanted side effects. Recommended safe transitions are illustrated in Figure 24 Other transitions are potentially risky and should be avoided, since they are likely to present unwanted side-effects such as spurious interrupt generation. Figure 24. Interrupt I/O Port State Transitions
XX = DDR, OR
The I/O port register configurations are summarized as follows: Table 11. Port Configuration
Port Pin name PA7 PA6:1 PA0 PB4 PB3 PB2:1 PB0 Input (DDR = 0) OR = 0 OR = 1 pull-up interrupt pull-up pull-up interrupt floating pull-up pull-up interrupt pull-up pull-up interrupt Output (DDR = 1) OR = 0 OR = 1
Port A
open drain
push-pull
Port B
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I/O PORTS (Cont'd) Table 12. I/O Port Register Map and Reset Values
Address (Hex.) 0000h 0001h 0002h 0003h 0004h 0005h Register Label PADR Reset Value PADDR Reset Value PAOR Reset Value PBDR Reset Value PBDDR Reset Value PBOR Reset Value 7 MSB 0 MSB 0 MSB 0 MSB 1 MSB 0 MSB 0 6 5 4 3 2 1 0 LSB 0 LSB 0 LSB 0 LSB 0 LSB 0 LSB 0
0 0 1 1 0 0
0 0 0 1 0 0
0 0 0 0 0 0
0 0 0 0 0 0
0 0 0 0 0 0
0 0 0 0 0 0
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11 ON-CHIP PERIPHERALS
11.1 LITE TIMER (LT) 11.1.1 Introduction The Lite Timer can be used for general-purpose timing functions. It is based on a free-running 8-bit upcounter with two software-selectable timebase periods, an 8-bit input capture register and watchdog function. 11.1.2 Main Features Realtime Clock - 8-bit upcounter - 1 ms or 2 ms timebase period (@ 8 MHz fOSC) - Maskable timebase interrupt Input Capture - 8-bit input capture register (LTICR) - Maskable interrupt with wakeup from Halt Mode capability Figure 25. Lite Timer Block Diagram
fLTIMER
To 12-bit AT TImer
Watchdog - Enabled by hardware or software (configurable by option byte) - Optional reset on HALT instruction (configurable by option byte) - Automatically resets the device unless disable bit is refreshed - Software reset (Forced Watchdog reset) - Watchdog reset status flag
fWDG fOSC/32 8-bit UPCOUNTER /2 fLTIMER 1 0
WATCHDOG
WATCHDOG RESET
Timebase 1 or 2 ms (@ 8 MHz fOSC)
LTICR
8
LTIC
8-bit INPUT CAPTURE REGISTER LTCSR
ICIE 7 ICF TB TBIE TBF WDG RF WDGE WDGD 0
LTTB INTERRUPT REQUEST LTIC INTERRUPT REQUEST
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LITE TIMER (Cont'd) 11.1.3 Functional Description The value of the 8-bit counter cannot be read or written by software. After an MCU reset, it starts incrementing from 0 at a frequency of fOSC/32. A counter overflow event occurs when the counter rolls over from F9h to 00h. If fOSC = 8 MHz, then the time period between two counter overflow events is 1 ms. This period can be doubled by setting the TB bit in the LTCSR register. When the timer overflows, the TBF bit is set by hardware and an interrupt request is generated if the TBIE is set. The TBF bit is cleared by software reading the LTCSR register. 11.1.3.1 Watchdog The watchdog is enabled using the WDGE bit. The normal Watchdog timeout is 2ms (@ = 8 MHz fOSC), after which it then generates a reset. To prevent this watchdog reset occuring, software must set the WDGD bit. The WDGD bit is cleared by hardware after tWDG. This means that software must write to the WDGD bit at regular intervals to prevent a watchdog reset occurring. Refer to Figure 26. If the watchdog is not enabled immediately after reset, the first watchdog timeout will be shorter than 2ms, because this period is counted starting from reset. Moreover, if a 2ms period has already elapsed after the last MCU reset, the watchdog reset will take place as soon as the WDGE bit is set. For these reasons, it is recommended to enable the Watchdog immediately after reset or else to set the WDGD bit before the WGDE bit so a watchdog reset will not occur for at least 2ms. Note: Software can use the timebase feature to set the WDGD bit at 1 or 2 ms intervals.
A Watchdog reset can be forced at any time by setting the WDGRF bit. To generate a forced watchdog reset, first watchdog has to be activated by setting the WDGE bit and then the WDGRF bit has to be set. The WDGRF bit also acts as a flag, indicating that the Watchdog was the source of the reset. It is automatically cleared after it has been read. Caution: When the WDGRF bit is set, software must clear it, otherwise the next time the watchdog is enabled (by hardware or software), the microcontroller will be immediately reset. Hardware Watchdog Option If Hardware Watchdog is selected by option byte, the watchdog is always active and the WDGE bit in the LTCSR is not used. Refer to the Option Byte description in the "device configuration and ordering information" section. Using Halt Mode with the Watchdog (option) If the Watchdog reset on HALT option is not selected by option byte, the Halt mode can be used when the watchdog is enabled. In this case, the HALT instruction stops the oscillator. When the oscillator is stopped, the Lite Timer stops counting and is no longer able to generate a Watchdog reset until the microcontroller receives an external interrupt or a reset. If an external interrupt is received, the WDG restarts counting after 256 CPU clocks. If a reset is generated, the Watchdog is disabled (reset state). If Halt mode with Watchdog is enabled by option byte (No watchdog reset on HALT instruction), it is recommended before executing the HALT instruction to refresh the WDG counter, to avoid an unexpected WDG reset immediately after waking up the microcontroller.
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LITE TIMER (Cont'd) Figure 26. Watchdog Timing Diagram
HARDWARE CLEARS WDGD BIT
fWDG WDGD BIT INTERNAL WATCHDOG RESET
tWDG (2ms @ 8 MHz fOSC)
SOFTWARE SETS WDGD BIT
WATCHDOG RESET
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LITE TIMER (Cont'd) Input Capture The 8-bit input capture register is used to latch the free-running upcounter after a rising or falling edge is detected on the LTIC pin. When an input capture occurs, the ICF bit is set and the LTICR register contains the value of the free-running upcounter. An interrupt is generated if the ICIE bit is set. The ICF bit is cleared by reading the LTICR register. The LTICR is a read only register and always contains the data from the last input capture. Input capture is inhibited if the ICF bit is set. 11.1.4 Low Power Modes
Mode SLOW WAIT ACTIVE HALT HALT Description No effect on Lite timer (this peripheral is driven directly by fOSC/32) No effect on Lite timer No effect on Lite timer Lite timer stops counting
11.1.5 Interrupts
Interrupt Event Timebase Event IC Event Event Flag TBF ICF Enable Control Bit TBIE ICIE Exit from Wait Yes Exit from Halt No Exit from ActiveHalt Yes No
Note: The TBF and ICF interrupt events are connected to separate interrupt vectors (see Interrupts chapter). Timebase and IC events generate an interrupt if the enable bit is set in the LTCSR register and the interrupt mask in the CC register is reset (RIM instruction).
Figure 27. Input Capture Timing Diagram
4s (@ 8 MHz fOSC)
fCPU fOSC/32 CLEARED BY S/W READING LTIC REGISTER
8-bit COUNTER LTIC PIN ICF FLAG LTICR REGISTER
01h
02h
03h
04h
05h
06h
07h
xxh
04h
07h
t
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LITE TIMER (Cont'd) 11.1.6 Register Description LITE TIMER CONTROL/STATUS REGISTER (LTCSR) Read / Write Reset Value: 0x00 0000 (x0h)
7 ICIE ICF TB TBIE TBF 0 WDGR WDGE WDGD
0: No counter overflow 1: A counter overflow has occurred Bit 2 = WDGRF Force Reset/ Reset Status Flag This bit is used in two ways: it is set by software to force a watchdog reset. It is set by hardware when a watchdog reset occurs and cleared by hardware or by software. It is cleared by hardware only when an LVD reset occurs. It can be cleared by software after a read access to the LTCSR register. 0: No watchdog reset occurred. 1: Force a watchdog reset (write), or, a watchdog reset occurred (read). Bit 1 = WDGE Watchdog Enable This bit is set and cleared by software. 0: Watchdog disabled 1: Watchdog enabled Bit 0 = WDGD Watchdog Reset Delay This bit is set by software. It is cleared by hardware at the end of each tWDG period. 0: Watchdog reset not delayed 1: Watchdog reset delayed LITE TIMER INPUT CAPTURE REGISTER (LTICR) Read only Reset Value: 0000 0000 (00h)
7 ICR7 ICR6 ICR5 ICR4 ICR3 ICR2 ICR1 0 ICR0
Bit 7 = ICIE Interrupt Enable This bit is set and cleared by software. 0: Input Capture (IC) interrupt disabled 1: Input Capture (IC) interrupt enabled Bit 6 = ICF Input Capture Flag This bit is set by hardware and cleared by software by reading the LTICR register. Writing to this bit does not change the bit value. 0: No input capture 1: An input capture has occurred Note: After an MCU reset, software must initialise the ICF bit by reading the LTICR register Bit 5 = TB Timebase period selection This bit is set and cleared by software. 0: Timebase period = tOSC * 8000 (1ms @ 8 MHz) 1: Timebase period = tOSC * 16000 (2ms @ 8 MHz) Bit 4 = TBIE Timebase Interrupt enable This bit is set and cleared by software. 0: Timebase (TB) interrupt disabled 1: Timebase (TB) interrupt enabled Bit 3 = TBF Timebase Interrupt Flag This bit is set by hardware and cleared by software reading the LTCSR register. Writing to this bit has no effect.
Bit 7:0 = ICR[7:0] Input Capture Value These bits are read by software and cleared by hardware after a reset. If the ICF bit in the LTCSR is cleared, the value of the 8-bit up-counter will be captured when a rising or falling edge occurs on the LTIC pin.
Table 13. Lite Timer Register Map and Reset Values
Address (Hex.) 0B 0C Register Label LTCSR Reset Value LTICR Reset Value 7 ICIE 0 ICR7 0 6 ICF x ICR6 0 5 TB 0 ICR5 0 4 TBIE 0 ICR4 0 3 TBF 0 ICR3 0 2 WDGRF 0 ICR2 0 1 WDGE 0 ICR1 0 0 WDGD 0 ICR0 0
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11.2 12-BIT AUTORELOAD TIMER (AT) 11.2.1 Introduction The 12-bit Autoreload Timer can be used for general-purpose timing functions. It is based on a freerunning 12-bit upcounter with a PWM output channel. 11.2.2 Main Features 12-bit upcounter with 12-bit autoreload register (ATR) Maskable overflow interrupt PWM signal generator Figure 28. Block Diagram
7 ATCSR 0 0 0 CK1 CK0 0 OVF OVFIE CMPIE OVF INTERRUPT REQUEST
Frequency range 2 kHz to 4 MHz (@ 8 MHz fCPU) - Programmable duty-cycle - Polarity control - Maskable Compare interrupt Output Compare Function
fLTIMER (1 ms timebase @ 8 MHz) fCPU
CMPF0 fCOUNTER CNTR 12-BIT UPCOUNTER
CMP INTERRUPT REQUEST
Update on OVF Event
12-BIT AUTORELOAD VALUE
ATR OE0 bit PWM GENERATION OE0 bit CMPF0 bit 0 COMPPARE OP0 bit fPWM POLARITY OUTPUT CONTROL DCR0H DCR0L
Preload
Preload on OVF Event IF OE0= 1
PWM0
1
12-BIT DUTY CYCLE VALUE (shadow)
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12-BIT AUTORELOAD TIMER (Cont'd) 11.2.3 Functional Description PWM Mode This mode allows a Pulse Width Modulated signals generated on the PWM0 output pin with minimum core processing overhead. The PWM0 output signal can be enabled or disabled using the OE0 bit in the PWMCR register. When this bit is set the PWM I/O pin is configured as output pushpull alternate function. Note: CMPF0 is available in PWM mode (see PWM0CSR description on page 51). PWM Frequency and Duty Cycle The PWM signal frequency (fPWM) is controlled by the counter period and the ATR register value. fPWM = fCOUNTER / (4096 - ATR) Following the above formula, if fCPU is 8 MHz, the maximum value of fPWM is 4 MHz (ATR register value = 4094), and the minimum value is 2 kHz (ATR register value = 0). Note: The maximum value of ATR is 4094 because it must be lower than the DCR value which must be 4095 in this case. At reset, the counter starts counting from 0. Software must write the duty cycle value in the DCR0H and DCR0L preload registers. The DCR0H register must be written first. See caution below.
When a upcounter overflow occurs (OVF event), the ATR value is loaded in the upcounter, the preloaded Duty cycle value is transferred to the Duty Cycle register and the PWM0 signal is set to a high level. When the upcounter matches the DCRx value the PWM0 signals is set to a low level. To obtain a signal on the PWM0 pin, the contents of the DCR0 register must be greater than the contents of the ATR register. The polarity bit can be used to invert the output signal. The maximum available resolution for the PWM0 duty cycle is: Resolution = 1 / (4096 - ATR) Note: To get the maximum resolution (1/4096), the ATR register must be 0. With this maximum resolution and assuming that DCR = ATR, a 0% or 100% duty cycle can be obtained by changing the polarity. Caution: As soon as the DCR0H is written, the compare function is disabled and will start only when the DCR0L value is written. If the DCR0H write occurs just before the compare event, the signal on the PWM output may not be set to a low level. In this case, the DCRx register should be updated just after an OVF event. If the DCR and ATR values are close, then the DCRx register should be updated just before an OVF event, to avoid missing a compare event and to have the right signal applied on the PWM output.
Figure 29. PWM Function
4095 DUTY CYCLE REGISTER (DCR0)
COUNTER
AUTORELOAD REGISTER (ATR) 000
t
PWM0 OUTPUT
WITH OE0 = 1 AND OP0 = 0 WITH OE0 = 1 AND OP0 = 1
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12-BIT AUTORELOAD TIMER (Cont'd) Figure 30. PWM Signal Example
fCOUNTER ATR = FFDh PWM0 OUTPUT WITH OE0 = 1 AND OP0 = 0 COUNTER FFDh FFEh FFFh FFDh FFEh FFFh FFDh FFEh
DCR0 = FFEh
t
Output Compare Mode To use this function, the OE bit must be 0, otherwise the compare is done with the shadow register instead of the DCRx register. Software must then write a 12-bit value in the DCR0H and DCR0L registers. This value is loaded immediately (without waiting for an OVF event). The DCR0H must be written first, the output compare function starts only when the DCR0L value is written. When the 12-bit upcounter (CNTR) reaches the value stored in the DCR0H and DCR0L registers, the CMPF0 bit in the PWM0CSR register is set and an interrupt request is generated if the CMPIE bit is set. Note: The output compare function is only available for DCRx values other than 0 (reset value). Caution: At each OVF event, the DCRx value is written in a shadow register, even if the DCR0L value has not yet been written (in this case, the shadow register will contain the new DCR0H value and the old DCR0L value), then: - If OE = 1 (PWM mode): The compare is done between the timer counter and the shadow register (and not DCRx). - if OE = 0 (OCMP mode): The compare is done between the timer counter and DCRx. There is no PWM signal.
The compare between DCRx or the shadow register and the timer counter is locked until DCR0L is written. 11.2.4 Low Power Modes
Mode SLOW WAIT ACTIVE HALT HALT Description The input frequency is divided by 32 No effect on AT timer AT timer halted except if CK0 = 1, CK1 = 0 and OVFIE = 1 AT timer halted
11.2.5 Interrupts
Interrupt Event1) Overflow Event CMP Event Enable Exit Exit Event Control from from Flag Wait Halt Bit OVF OVFIE Yes No No Exit from Active Halt Yes2) No
CMPFx CMPIE Yes
Notes: 1. The interrupt events are connected to separate interrupt vectors (see Interrupts chapter). They generate an interrupt if the enable bit is set in the ATCSR register and the interrupt mask in the CC register is reset (RIM instruction). 2. Only if CK0 = 1 and CK1 = 0.
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12-BIT AUTORELOAD TIMER (Cont'd) 11.2.6 Register Description TIMER CONTROL STATUS REGISTER (ATCSR) Read / Write Reset Value: 0000 0000 (00h)
7 0 0 0 CK1 CK0 OVF 0 OVFIE CMPIE
Bit 0 = CMPIE Compare Interrupt Enable This bit is read/write by software and clear by hardware after a reset. It allows to mask the interrupt generation when CMPF bit is set. 0: CMPF interrupt disabled 1: CMPF interrupt enabled
COUNTER REGISTER HIGH (CNTRH) Read only Reset Value: 0000 0000 (00h)
15 0 0 0 0 CN11 CN10 CN9 8 CN8
Bit 7:5 = Reserved, must be kept cleared.
Bit 4:3 = CK[1:0] Counter Clock Selection These bits are set and cleared by software and cleared by hardware after a reset. They select the clock frequency of the counter.
Counter Clock Selection OFF fLTIMER (1 ms timebase @ 8 MHz) fCPU Reserved CK1 0 0 1 1 CK0 0 1 0 1
COUNTER REGISTER LOW (CNTRL) Read only Reset Value: 0000 0000 (00h)
7 CN7 CN6 CN5 CN4 CN3 CN2 CN1 0 CN0
Bit 2 = OVF Overflow Flag This bit is set by hardware and cleared by software by reading the ATCSR register. It indicates the transition of the counter from FFFh to ATR value. 0: No counter overflow occurred 1: Counter overflow occurred Caution: When set, the OVF bit stays high for 1 fCOUNTER cycle, (up to 1ms depending on the clock selection).
Bits 15:12 = Reserved, must be kept cleared. Bits 11:0 = CNTR[11:0] Counter Value This 12-bit register is read by software and cleared by hardware after a reset. The counter is incremented continuously as soon as a counter clock is selected. To obtain the 12-bit value, software should read the counter value in two consecutive read operations. The CNTRH register can be incremented between the two reads, and in order to be accurate when fTIMER = fCPU, the software should take this into account when CNTRL and CNTRH are read. If CNTRL is close to its highest value, CNTRH could be incremented before it is read. When a counter overflow occurs, the counter restarts from the value specified in the ATR register.
Bit 1 = OVFIE Overflow Interrupt Enable This bit is read/write by software and cleared by hardware after a reset. 0: OVF interrupt disabled 1: OVF interrupt enabled
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12-BIT AUTORELOAD TIMER (Cont'd) AUTORELOAD REGISTER (ATRH) Read / Write Reset Value: 0000 0000 (00h)
15 0 0 0 0 ATR11 ATR10 ATR9 8 ATR8
PWM0 DUTY CYCLE REGISTER LOW (DCR0L) Read / Write Reset Value: 0000 0000 (00h)
7 DCR7 DCR6 DCR5 DCR4 DCR3 DCR2 0 DCR1 DCR0
AUTORELOAD REGISTER (ATRL) Read / Write Reset Value: 0000 0000 (00h)
7 ATR7 ATR6 ATR5 ATR4 ATR3 ATR2 ATR1 0 ATR0
Bits 15:12 = Reserved, must be kept cleared.
Bits 11:0 = DCR[11:0] PWMx Duty Cycle Value This 12-bit value is written by software. The high register must be written first. In PWM mode (OE0 = 1 in the PWMCR register) the DCR[11:0] bits define the duty cycle of the PWM0 output signal (see Figure 29). In Output Compare mode, (OE0 = 0 in the PWMCR register) they define the value to be compared with the 12bit upcounter value.
Bits 15:12 = Reserved, must be kept cleared.
Bits 11:0 = ATR[11:0] Autoreload Register This is a 12-bit register which is written by software. The ATR register value is automatically loaded into the upcounter when an overflow occurs. The register value is used to set the PWM frequency. PWM0 DUTY CYCLE REGISTER HIGH (DCR0H) Read / Write Reset Value: 0000 0000 (00h)
15 0 0 0 0 8
PWM0 CONTROL/STATUS (PWM0CSR) Read / Write Reset Value: 0000 0000 (00h)
7 0 0 0 0 0 0
REGISTER
0 OP0 CMPF0
Bit 7:2 = Reserved, must be kept cleared.
DCR11 DCR10 DCR9 DCR8
Bit 1 = OP0 PWM0 Output Polarity This bit is read/write by software and cleared by hardware after a reset. This bit selects the polarity of the PWM0 signal. 0: The PWM0 signal is not inverted. 1: The PWM0 signal is inverted. Bit 0 = CMPF0 PWM0 Compare Flag. This bit is set by hardware and cleared by software by reading the PWM0CSR register. It indicates that the upcounter value matches the DCR0 register value. 0: Upcounter value does not match DCR value. 1: Upcounter value matches DCR value.
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12-BIT AUTORELOAD TIMER (Cont'd) PWM OUTPUT CONTROL REGISTER (PWMCR) Read/Write Reset Value: 0000 0000 (00h)
7
0 0 0 0 0 0 0
Bits 7:1 = Reserved, must be kept cleared. Bit 0 = OE0 PWM0 Output enable This bit is set and cleared by software. 0: PWM0 output Alternate Function disabled (I/O pin free for general purpose I/O) 1: PWM0 output enabled
0
OE0
Table 14. Register Map and Reset Values
Address (Hex.) 0D 0E 0F 10 11 12 13 17 18 Register Label ATCSR Reset Value CNTRH Reset Value CNTRL Reset Value ATRH Reset Value ATRL Reset Value PWMCR Reset Value PWM0CSR Reset Value DCR0H Reset Value DCR0L Reset Value 7 0 0 CN7 0 0 ATR7 0 0 0 0 DCR7 0 6 0 0 CN6 0 0 ATR6 0 0 0 0 DCR6 0 5 0 0 CN5 0 0 ATR5 0 0 0 0 DCR5 0 4 CK1 0 0 CN4 0 0 ATR4 0 0 0 0 DCR4 0 3 CK0 0 CN11 0 CN3 0 ATR11 0 ATR3 0 0 0 DCR11 0 DCR3 0 2 OVF 0 CN10 0 CN2 0 ATR10 0 ATR2 0 0 0 DCR10 0 DCR2 0 1 OVFIE 0 CN9 0 CN1 0 ATR9 0 ATR1 0 0 OP 0 DCR9 0 DCR1 0 0 CMPIE 0 CN8 0 CN0 0 ATR8 0 ATR0 0 OE0 0 CMPF0 0 DCR8 0 DCR0 0
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11.3 SERIAL PERIPHERAL INTERFACE (SPI) 11.3.1 Introduction The Serial Peripheral Interface (SPI) allows fullduplex, synchronous, serial communication with external devices. An SPI system may consist of a master and one or more slaves however the SPI interface can not be a master in a multi-master system. 11.3.2 Main Features Full duplex synchronous transfers (on 3 lines) Simplex synchronous transfers (on 2 lines) Master or slave operation Six master mode frequencies (fCPU/4 max.) fCPU/2 max. slave mode frequency (see note) SS Management by software or hardware Programmable clock polarity and phase End of transfer interrupt flag Write collision, Master Mode Fault and Overrun flags Note: In slave mode, continuous transmission is not possible at maximum frequency due to the software overhead for clearing status flags and to initiate the next transmission sequence. 11.3.3 General Description Figure 31 shows the serial peripheral interface (SPI) block diagram for three registers: - SPI Control Register (SPICR) - SPI Control/Status Register (SPICSR) - SPI Data Register (SPIDR) The SPI is connected to external devices through three pins: - MISO: Master In / Slave Out data - MOSI: Master Out / Slave In data - SCK: Serial Clock out by SPI masters and input by SPI slaves - SS: Slave select: This input signal acts as a `chip select' to let the SPI master communicate with slaves individually and to avoid contention on the data lines. Slave SS inputs can be driven by standard I/O ports on the master MCU.
Figure 31. Serial Peripheral Interface Block Diagram
Data/Address Bus SPIDR Read Read Buffer Interrupt request
MOSI MISO
8-bit Shift Register
7 SPIF WCOL OVR MODF 0
SPICSR
SOD SSM
0 SSI
SOD bit
Write
SS
SPI STATE CONTROL
7 SPIE
1 0
SCK
SPICR
0
SPE SPR2 MSTR CPOL CPHA SPR1 SPR0
MASTER CONTROL SERIAL CLOCK GENERATOR
SS
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SERIAL PERIPHERAL INTERFACE (Cont'd) 11.3.3.1 Functional Description A basic example of interconnections between a single master and a single slave is illustrated in Figure 32. The MOSI pins are connected together and the MISO pins are connected together. In this way data is transferred serially between master and slave (most significant bit first). The communication is always initiated by the master. When the master device transmits data to a slave device via MOSI pin, the slave device reFigure 32. Single Master/ Single Slave Application
MASTER MSBit LSBit MISO MISO MSBit SLAVE LSBit
sponds by sending data to the master device via the MISO pin. This implies full duplex communication with both data out and data in synchronized with the same clock signal (which is provided by the master device via the SCK pin). To use a single data line, the MISO and MOSI pins must be connected at each node (in this case only simplex communication is possible). Four possible data/clock timing relationships may be chosen (see Figure 35) but master and slave must be programmed with the same timing mode.
8-bit SHIFT REGISTER
8-bit SHIFT REGISTER
MOSI
MOSI
SPI CLOCK GENERATOR
SCK SS +5V
SCK SS Not used if SS is managed by software
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SERIAL PERIPHERAL INTERFACE (Cont'd) 11.3.3.2 Slave Select Management As an alternative to using the SS pin to control the Slave Select signal, the application can choose to manage the Slave Select signal by software. This is configured by the SSM bit in the SPICSR register (see Figure 34) In software management, the external SS pin is free for other application uses and the internal SS signal level is driven by writing to the SSI bit in the SPICSR register. In Master mode: - SS internal must be held high continuously
In Slave mode: Two cases depend on the data/clock timing relationship (see Figure 33): If CPHA = 1 (data latched on 2nd clock edge): - SS internal must be held low during the entire transmission. This implies that in single slave applications the SS pin either can be tied to VSS, or made free for standard I/O by managing the SS function by software (SSM = 1 and SSI = 0 in the in the SPICSR register) If CPHA = 0 (data latched on 1st clock edge): - SS internal must be held low during byte transmission and pulled high between each byte to allow the slave to write to the shift register. If SS is not pulled high, a Write Collision error will occur when the slave writes to the shift register (see Section 11.3.5.3).
Figure 33. Generic SS Timing Diagram
MOSI/MISO Master SS Slave SS (if CPHA = 0) Slave SS (if CPHA = 1)
Byte 1
Byte 2
Byte 3
Figure 34. Hardware/Software Slave Select Management SSM bit
SSI bit SS external pin
1 0
SS internal
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SERIAL PERIPHERAL INTERFACE (Cont'd) 11.3.3.3 Master Mode Operation In master mode, the serial clock is output on the SCK pin. The clock frequency, polarity and phase are configured by software (refer to the description of the SPICSR register). Note: The idle state of SCK must correspond to the polarity selected in the SPICSR register (by pulling up SCK if CPOL = 1 or pulling down SCK if CPOL = 0). How to operate the SPI in master mode To operate the SPI in master mode, perform the following steps in order: 1. Write to the SPICR register: - Select the clock frequency by configuring the SPR[2:0] bits. - Select the clock polarity and clock phase by configuring the CPOL and CPHA bits. Figure 35 shows the four possible configurations. Note: The slave must have the same CPOL and CPHA settings as the master. 2. Write to the SPICSR register: - Either set the SSM bit and set the SSI bit or clear the SSM bit and tie the SS pin high for the complete byte transmit sequence. 3. Write to the SPICR register: - Set the MSTR and SPE bits Note: MSTR and SPE bits remain set only if SS is high. Important note: If the SPICSR register is not written first, the SPICR register setting (MSTR bit) may be not taken into account. The transmit sequence begins when software writes a byte in the SPIDR register. 11.3.3.4 Master Mode Transmit Sequence When software writes to the SPIDR register, the data byte is loaded into the 8-bit shift register and then shifted out serially to the MOSI pin most significant bit first. When data transfer is complete: - The SPIF bit is set by hardware - An interrupt request is generated if the SPIE bit is set and the interrupt mask in the CCR register is cleared. Clearing the SPIF bit is performed by the following software sequence: 1. An access to the SPICSR register while the SPIF bit is set 2. A read to the SPIDR register.
Note: While the SPIF bit is set, all writes to the SPIDR register are inhibited until the SPICSR register is read. 11.3.3.5 Slave Mode Operation In slave mode, the serial clock is received on the SCK pin from the master device. To operate the SPI in slave mode: 1. Write to the SPICSR register to perform the following actions: - Select the clock polarity and clock phase by configuring the CPOL and CPHA bits (see Figure 35). Note: The slave must have the same CPOL and CPHA settings as the master. - Manage the SS pin as described in Section 11.3.3.2 and Figure 33. If CPHA = 1 SS must be held low continuously. If CPHA = 0 SS must be held low during byte transmission and pulled up between each byte to let the slave write in the shift register. 2. Write to the SPICR register to clear the MSTR bit and set the SPE bit to enable the SPI I/O functions. 11.3.3.6 Slave Mode Transmit Sequence When software writes to the SPIDR register, the data byte is loaded into the 8-bit shift register and then shifted out serially to the MISO pin most significant bit first. The transmit sequence begins when the slave device receives the clock signal and the most significant bit of the data on its MOSI pin. When data transfer is complete: - The SPIF bit is set by hardware - An interrupt request is generated if SPIE bit is set and interrupt mask in the CCR register is cleared. Clearing the SPIF bit is performed by the following software sequence: 1. An access to the SPICSR register while the SPIF bit is set. 2. A write or a read to the SPIDR register. Notes: While the SPIF bit is set, all writes to the SPIDR register are inhibited until the SPICSR register is read. The SPIF bit can be cleared during a second transmission; however, it must be cleared before the second SPIF bit in order to prevent an Overrun condition (see Section 11.3.5.2).
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SERIAL PERIPHERAL INTERFACE (Cont'd) 11.3.4 Clock Phase and Clock Polarity Four possible timing relationships may be chosen by software, using the CPOL and CPHA bits (See Figure 35). Note: The idle state of SCK must correspond to the polarity selected in the SPICSR register (by pulling up SCK if CPOL = 1 or pulling down SCK if CPOL = 0). The combination of the CPOL clock polarity and CPHA (clock phase) bits selects the data capture clock edge Figure 35. Data Clock Timing Diagram
CPHA = 1
SCK (CPOL = 1) SCK (CPOL = 0)
Figure 35, shows an SPI transfer with the four combinations of the CPHA and CPOL bits. The diagram may be interpreted as a master or slave timing diagram when the SCK pin, the MISO pin, the MOSI pin are directly connected between the master and the slave device. Note: If CPOL is changed at the communication byte boundaries, the SPI must be disabled by resetting the SPE bit.
MISO (from master) MOSI (from slave) SS (to slave)
CAPTURE STROBE
MSBit
Bit 6
Bit 5
Bit 4
Bit3
Bit 2
Bit 1
LSBit
MSBit
Bit 6
Bit 5
Bit 4
Bit3
Bit 2
Bit 1
LSBit
CPHA = 0
SCK (CPOL = 1) SCK (CPOL = 0)
MISO (from master) MOSI (from slave) SS (to slave)
CAPTURE STROBE
MSBit
Bit 6
Bit 5
Bit 4
Bit3
Bit 2
Bit 1
LSBit
MSBit
Bit 6
Bit 5
Bit 4
Bit3
Bit 2
Bit 1
LSBit
Note: This figure should not be used as a replacement for parametric information. Refer to the Electrical Characteristics chapter.
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SERIAL PERIPHERAL INTERFACE (Cont'd) 11.3.5 Error Flags 11.3.5.1 Master Mode Fault (MODF) Master mode fault occurs when the master device has its SS pin pulled low. When a Master mode fault occurs: - The MODF bit is set and an SPI interrupt request is generated if the SPIE bit is set. - The SPE bit is reset. This blocks all output from the device and disables the SPI peripheral. - The MSTR bit is reset, thus forcing the device into slave mode. Clearing the MODF bit is done through a software sequence: 1. A read access to the SPICSR register while the MODF bit is set. 2. A write to the SPICR register. Notes: To avoid any conflicts in an application with multiple slaves, the SS pin must be pulled high during the MODF bit clearing sequence. The SPE and MSTR bits may be restored to their original state during or after this clearing sequence. Hardware does not allow the user to set the SPE and MSTR bits while the MODF bit is set except in the MODF bit clearing sequence. 11.3.5.2 Overrun Condition (OVR) An overrun condition occurs, when the master device has sent a data byte and the slave device has
not cleared the SPIF bit issued from the previously transmitted byte. When an Overrun occurs: - The OVR bit is set and an interrupt request is generated if the SPIE bit is set. In this case, the receiver buffer contains the byte sent after the SPIF bit was last cleared. A read to the SPIDR register returns this byte. All other bytes are lost. The OVR bit is cleared by reading the SPICSR register. 11.3.5.3 Write Collision Error (WCOL) A write collision occurs when the software tries to write to the SPIDR register while a data transfer is taking place with an external device. When this happens, the transfer continues uninterrupted; and the software write is unsuccessful. Write collisions can occur both in master and slave mode. See also Section 11.3.3.2 Slave Select Management. Note: A "read collision" will never occur since the received data byte is placed in a buffer in which access is always synchronous with the MCU operation. The WCOL bit in the SPICSR register is set if a write collision occurs. No SPI interrupt is generated when the WCOL bit is set (the WCOL bit is a status flag only). Clearing the WCOL bit is done through a software sequence (see Figure 36).
Figure 36. Clearing the WCOL bit (Write Collision Flag) Software Sequence Clearing sequence after SPIF = 1 (end of a data byte transfer) 1st Step Read SPICSR
RESULT
2nd Step
Read SPIDR
SPIF = 0 WCOL = 0
Clearing sequence before SPIF = 1 (during a data byte transfer) 1st Step 2nd Step Read SPICSR
RESULT
Read SPIDR
WCOL = 0
Note: Writing to the SPIDR register instead of reading it does not reset the WCOL bit.
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SERIAL PERIPHERAL INTERFACE (Cont'd) 11.3.5.4 Single Master Systems A typical single master system may be configured, using an MCU as the master and four MCUs as slaves (see Figure 37). The master device selects the individual slave devices by using four pins of a parallel port to control the four SS pins of the slave devices. The SS pins are pulled high during reset since the master device ports are forced as inputs at that time, thus disabling the slave devices.
Note: To prevent a bus conflict on the MISO line the master allows only one active slave device during a transmission. For more security, the slave device may respond to the master with the received data byte. Then the master will receive the previous byte back from the slave device if all MISO and MOSI pins are connected and the slave has not written to its SPIDR register. Other transmission security methods can use ports for handshake lines or data bytes with command fields.
Figure 37. Single Master / Multiple Slave Configuration
SS SCK Slave MCU MOSI MISO SCK Slave MCU
SS SCK Slave MCU
SS SCK Slave MCU
SS
MOSI MISO
MOSI MISO
MOSI MISO
MOSI MISO SCK Master MCU 5V SS Ports
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SERIAL PERIPHERAL INTERFACE (Cont'd) 11.3.6 Low Power Modes
Mode WAIT Description No effect on SPI. SPI interrupt events cause the device to exit from WAIT mode. SPI registers are frozen. In HALT mode, the SPI is inactive. SPI operation resumes when the MCU is woken up by an interrupt with "exit from HALT mode" capability. The data received is subsequently read from the SPIDR register when the software is running (interrupt vector fetching). If data is received before the wake-up event, then an overrun error is generated. This error can be detected after the fetch of the interrupt routine that woke up the device.
SPI exits from Slave mode, it returns to normal state immediately. Caution: The SPI can wake up the ST7 from Halt mode only if the Slave Select signal (external SS pin or the SSI bit in the SPICSR register) is low when the ST7 enters Halt mode. So if Slave selection is configured as external (see Section 11.3.3.2), make sure the master drives a low level on the SS pin when the slave enters Halt mode. 11.3.7 Interrupts
Interrupt Event Enable Event Control Flag Bit Exit from Wait Exit from Halt Yes SPIE Yes No
HALT
11.3.6.1 Using the SPI to wakeup the MCU from Halt mode In slave configuration, the SPI is able to wakeup the ST7 device from HALT mode through a SPIF interrupt. The data received is subsequently read from the SPIDR register when the software is running (interrupt vector fetch). If multiple data transfers have been performed before software clears the SPIF bit, then the OVR bit is set by hardware. Note: When waking up from Halt mode, if the SPI remains in Slave mode, it is recommended to perform an extra communications cycle to bring the SPI from Halt mode state to normal state. If the
SPI End of TransSPIF fer Event Master Mode Fault MODF Event Overrun Error OVR
Note: The SPI interrupt events are connected to the same interrupt vector (see Interrupts chapter). They generate an interrupt if the corresponding Enable Control Bit is set and the interrupt mask in the CC register is reset (RIM instruction).
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SERIAL PERIPHERAL INTERFACE (Cont'd) 11.3.8 Register Description CONTROL REGISTER (SPICR) Read/Write Reset Value: 0000 xxxx (0xh)
7 SPIE SPE SPR2 MSTR CPOL CPHA SPR1 0 SPR0
Bit 7 = SPIE Serial Peripheral Interrupt Enable This bit is set and cleared by software. 0: Interrupt is inhibited 1: An SPI interrupt is generated whenever SPIF = 1, MODF = 1 or OVR = 1 in the SPICSR register Bit 6 = SPE Serial Peripheral Output Enable This bit is set and cleared by software. It is also cleared by hardware when, in master mode, SS = 0 (see Section 11.3.5.1 Master Mode Fault (MODF)). The SPE bit is cleared by reset, so the SPI peripheral is not initially connected to the external pins. 0: I/O pins free for general purpose I/O 1: SPI I/O pin alternate functions enabled Bit 5 = SPR2 Divider Enable This bit is set and cleared by software and is cleared by reset. It is used with the SPR[1:0] bits to set the baud rate. Refer to Table 15 SPI Master mode SCK Frequency. 0: Divider by 2 enabled 1: Divider by 2 disabled Note: This bit has no effect in slave mode. Bit 4 = MSTR Master Mode This bit is set and cleared by software. It is also cleared by hardware when, in master mode, SS = 0 (see Section 11.3.5.1 Master Mode Fault (MODF)). 0: Slave mode 1: Master mode. The function of the SCK pin changes from an input to an output and the functions of the MISO and MOSI pins are reversed.
Bit 3 = CPOL Clock Polarity This bit is set and cleared by software. This bit determines the idle state of the serial Clock. The CPOL bit affects both the master and slave modes. 0: SCK pin has a low level idle state 1: SCK pin has a high level idle state Note: If CPOL is changed at the communication byte boundaries, the SPI must be disabled by resetting the SPE bit. Bit 2 = CPHA Clock Phase This bit is set and cleared by software. 0: The first clock transition is the first data capture edge. 1: The second clock transition is the first capture edge. Note: The slave must have the same CPOL and CPHA settings as the master. Bits 1:0 = SPR[1:0] Serial Clock Frequency These bits are set and cleared by software. Used with the SPR2 bit, they select the baud rate of the SPI serial clock SCK output by the SPI in master mode. Note: These 2 bits have no effect in slave mode. Table 15. SPI Master mode SCK Frequency
Serial Clock fCPU/4 fCPU/8 fCPU/16 fCPU/32 fCPU/64 fCPU/128 SPR2 1 0 0 1 0 0 SPR1 0 0 0 1 1 1 SPR0 0 0 1 0 0 1
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SERIAL PERIPHERAL INTERFACE (Cont'd) CONTROL/STATUS REGISTER (SPICSR) Read/Write (some bits Read Only) Reset Value: 0000 0000 (00h)
7 SPIF WCOL OVR MODF SOD SSM 0 SSI
Bit 3 = Reserved, must be kept cleared. Bit 2 = SOD SPI Output Disable This bit is set and cleared by software. When set, it disables the alternate function of the SPI output (MOSI in master mode / MISO in slave mode) 0: SPI output enabled (if SPE = 1) 1: SPI output disabled Bit 1 = SSM SS Management This bit is set and cleared by software. When set, it disables the alternate function of the SPI SS pin and uses the SSI bit value instead. See Section 11.3.3.2 Slave Select Management. 0: Hardware management (SS managed by external pin) 1: Software management (internal SS signal controlled by SSI bit. External SS pin free for general-purpose I/O) Bit 0 = SSI SS Internal Mode This bit is set and cleared by software. It acts as a `chip select' by controlling the level of the SS slave select signal when the SSM bit is set. 0: Slave selected 1: Slave deselected DATA I/O REGISTER (SPIDR) Read/Write Reset Value: Undefined
7 0 D6 D5 D4 D3 D2 D1 D0
Bit 7 = SPIF Serial Peripheral Data Transfer Flag (Read only) This bit is set by hardware when a transfer has been completed. An interrupt is generated if SPIE = 1 in the SPICR register. It is cleared by a software sequence (an access to the SPICSR register followed by a write or a read to the SPIDR register). 0: Data transfer is in progress or the flag has been cleared. 1: Data transfer between the device and an external device has been completed. Note: While the SPIF bit is set, all writes to the SPIDR register are inhibited until the SPICSR register is read. Bit 6 = WCOL Write Collision status (Read only) This bit is set by hardware when a write to the SPIDR register is done during a transmit sequence. It is cleared by a software sequence (see Figure 36). 0: No write collision occurred 1: A write collision has been detected Bit 5 = OVR SPI Overrun error (Read only) This bit is set by hardware when the byte currently being received in the shift register is ready for transfer into the SPIDR register while SPIF = 1 (See Section 11.3.5.2). An interrupt is generated if SPIE = 1 in the SPICR register. The OVR bit is cleared by software reading the SPICSR register. 0: No overrun error 1: Overrun error detected Bit 4 = MODF Mode Fault flag (Read only) This bit is set by hardware when the SS pin is pulled low in master mode (see Section 11.3.5.1 Master Mode Fault (MODF)). An SPI interrupt can be generated if SPIE = 1 in the SPICR register. This bit is cleared by a software sequence (An access to the SPICSR register while MODF = 1 followed by a write to the SPICR register). 0: No master mode fault detected 1: A fault in master mode has been detected
D7
The SPIDR register is used to transmit and receive data on the serial bus. In a master device, a write to this register will initiate transmission/reception of another byte. Notes: During the last clock cycle the SPIF bit is set, a copy of the received data byte in the shift register is moved to a buffer. When the user reads the serial peripheral data I/O register, the buffer is actually being read. While the SPIF bit is set, all writes to the SPIDR register are inhibited until the SPICSR register is read. Warning: A write to the SPIDR register places data directly into the shift register for transmission. A read to the SPIDR register returns the value located in the buffer and not the content of the shift register (see Figure 31).
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SERIAL PERIPHERAL INTERFACE (Cont'd) Table 16. SPI Register Map and Reset Values
Address (Hex.) 31 32 33 Register Label SPIDR Reset Value SPICR Reset Value SPICSR Reset Value 7 MSB x SPIE 0 SPIF 0 6 5 4 3 2 1 0 LSB x SPR0 x SSI 0
x SPE 0 WCOL 0
x SPR2 0 OVR 0
x MSTR 0 MODF 0
x CPOL x 0
x CPHA x SOD 0
x SPR1 x SSM 0
11.4 8-BIT A/D CONVERTER (ADC) 11.4.1 Introduction The on-chip Analog to Digital Converter (ADC) peripheral is a 8-bit, successive approximation converter with internal sample and hold circuitry. This peripheral has up to five multiplexed analog input channels (refer to device pin out description) that allow the peripheral to convert the analog voltage levels from up to five different sources. The result of the conversion is stored in a 8-bit Data Register. The A/D converter is controlled through a Control/Status Register. 11.4.2 Main Features - 8-bit conversion - Up to 5 channels with multiplexed input - Linear successive approximation Figure 38. ADC Block Diagram
fCPU
DIV 2 DIV 4 0 0 1 7
EOC SPEED ADON 0 0
- Data register (DR) which contains the results - Conversion complete status flag - On/off bit (to reduce consumption) 11.4.3 Functional Description 11.4.3.1 Analog Power Supply The block diagram is shown in Figure 38. VDD and VSS are the high and low level reference voltage pins. Conversion accuracy may therefore be impacted by voltage drops and noise in the event of heavily loaded or badly decoupled power supply lines. For more details, refer to Section 13 ELECTRICAL CHARACTERISTICS.
1
fADC
SLOW (ADCCSR2 Register) bit 0
CH2 CH1 CH0
ADCCSR
3
AIN0 AIN1
ANALOG MUX
HOLD CONTROL
RADC CADC
ANALOG TO DIGITAL CONVERTER
AINx
ADCDR
D7
D6
D5
D4
D3
D2
D1
D0
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8-BIT A/D CONVERTER (ADC) (Cont'd) 11.4.3.2 Digital A/D Conversion Result The conversion is monotonic, meaning that the result never decreases if the analog input does not and never increases if the analog input does not. If the input voltage (VAIN) is greater than or equal to VDDA (high-level voltage reference) then the conversion result in the DR register is FFh (full scale) without overflow indication. If input voltage (VAIN) is lower than or equal to VSSA (low-level voltage reference) then the conversion result in the DR register is 00h. The A/D converter is linear and the digital result of the conversion is stored in the ADCDR register. The accuracy of the conversion is described in the parametric section. RAIN is the maximum recommended impedance for an analog input signal. If the impedance is too high, this will result in a loss of accuracy due to leakage and sampling not being completed in the allotted time. 11.4.3.3 A/D Conversion Phases The A/D conversion is based on two conversion phases as shown in Figure 39: Sample capacitor loading [duration: tSAMPLE] During this phase, the VAIN input voltage to be measured is loaded into the CADC sample capacitor. A/D conversion [duration: tHOLD] During this phase, the A/D conversion is computed (8 successive approximations cycles) and the CADC sample capacitor is disconnected from the analog input pin to get the optimum analog to digital conversion accuracy. The total conversion time: tCONV = tSAMPLE + tHOLD While the ADC is on, these two phases are continuously repeated. At the end of each conversion, the sample capacitor is kept loaded with the previous measurement load. The advantage of this behavior is that it minimizes the current consumption on the analog pin in case of single input channel measurement. 11.4.3.4 Software Procedure Refer to the control/status register (CSR) and data register (DR) in Section 11.4.6 for the bit definitions and to Figure 39 for the timings. ADC Configuration The analog input ports must be configured as input, no pull-up, no interrupt. Refer to the I/O ports chapter. Using these pins as analog inputs does not affect the ability of the port to be read as a logic input. In the CSR register: - Select the CH[2:0] bits to assign the analog channel to be converted. ADC Conversion In the CSR register: - Set the ADON bit to enable the A/D converter and to start the first conversion. From this time on, the ADC performs a continuous conversion of the selected channel. When a conversion is complete - The EOC bit is set by hardware. - No interrupt is generated. - The result is in the DR register and remains valid until the next conversion has ended. A write to the ADCCSR register (with ADON set) aborts the current conversion, resets the EOC bit and starts a new conversion. Figure 39. ADC Conversion Timings
ADON tCONV tHOLD HOLD CONTROL tSAMPLE ADCCSR WRITE OPERATION
EOC BIT SET
11.4.4 Low Power Modes
Mode WAIT HALT Description No effect on A/D Converter A/D Converter disabled. After wakeup from Halt mode, the A/D Converter requires a stabilization time before accurate conversions can be performed.
Note: The A/D converter may be disabled by resetting the ADON bit. This feature allows reduced power consumption when no conversion is needed and between single shot conversions. 11.4.5 Interrupts None
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8-BIT A/D CONVERTER (ADC) (Cont'd) 11.4.6 Register Description CONTROL/STATUS REGISTER (ADCCSR) Read/Write Reset Value: 0000 0000 (00h)
7 EOC SPEED ADON 0 0 CH2 CH1 0 CH0
DATA REGISTER (ADCDR) Read Only Reset Value: 0000 0000 (00h)
7 D7 D6 D5 D4 D3 D2 D1 0 D0
Bit 7 = EOC Conversion Complete This bit is set by hardware. It is cleared by software reading the result in the DR register or writing to the CSR register. 0: Conversion is not complete 1: Conversion can be read from the DR register Bit 6 = SPEED ADC clock selection This bit is set and cleared by software. It is used together with the SLOW bit to configure the ADC clock speed. Refer to the table in the SLOW bit description. Bit 5 = ADON A/D Converter On This bit is set and cleared by software. 0: A/D converter is switched off 1: A/D converter is switched on Bit 4:3 = Reserved. must always be cleared. Bits 2:0 = CH[2:0] Channel Selection These bits are set and cleared by software. They select the analog input to convert.
Channel Pin1) AIN0 AIN1 AIN2 AIN3 AIN4 CH2 0 0 0 0 1 CH1 0 0 1 1 0 CH0 0 1 0 1 0
Bits 7:0 = D[7:0] Analog Converted Value This register contains the converted analog value in the range 00h to FFh. Note: Reading this register resets the EOC flag. CONTROL/STATUS REGISTER 2 (ADCCSR2) Read/Write Reset Value: 0000 0000 (00h)
7
0 0 0 0 SLOW 0 0
0
0
Bit 7:4 = Reserved. Forced by hardware to 0. Bit 3 = SLOW Slow mode This bit is set and cleared by software. It is used together with the SPEED bit to configure the ADC clock speed as shown on the table below.
fADC fCPU/2 fCPU fCPU/4 SLOW SPEED 0 0 0 1 1 x
Notes: 1. The number of pins AND the channel selection varies according to the device. Refer to the device pinout. 2. A write to the ADCCSR register (with ADON set) aborts the current conversion, resets the EOC bit and starts a new conversion.
Bit 2:0 = Reserved. Forced by hardware to 0. Note: If ADC settings are changed by writing the ADCCSR2 register while the ADC is running, a dummy conversion is needed before obtaining results with the new settings.
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8-BIT A/D CONVERTER (ADC) (Cont'd)
Table 17. ADC Register Map and Reset Values
Address (Hex.) 34h 35h 36h Register Label ADCCSR Reset Value ADCDR Reset Value ADCCSR2 Reset Value 7 EOC 0 D7 0 0 6 SPEED 0 D6 0 0 5 ADON 0 D5 0 0 4 3 2 CH2 0 D2 0 0 1 CH1 0 D1 0 0 0 CH0 0 D0 0 0
0 D4 0 0
0 D3 0 SLOW 0
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12 INSTRUCTION SET
12.1 ST7 ADDRESSING MODES The ST7 Core features 17 different addressing modes which can be classified in seven main groups:
Addressing Mode Inherent Immediate Direct Indexed Indirect Relative Bit operation nop ld A,#$55 ld A,$55 ld A,($55,X) ld A,([$55],X) jrne loop bset byte,#5 Example
The ST7 Instruction set is designed to minimize the number of bytes required per instruction: To do so, most of the addressing modes may be subdivided in two submodes called long and short: - Long addressing mode is more powerful because it can use the full 64 Kbyte address space, however it uses more bytes and more CPU cycles. - Short addressing mode is less powerful because it can generally only access page zero (0000h 00FFh range), but the instruction size is more compact, and faster. All memory to memory instructions use short addressing modes only (CLR, CPL, NEG, BSET, BRES, BTJT, BTJF, INC, DEC, RLC, RRC, SLL, SRL, SRA, SWAP) The ST7 Assembler optimizes the use of long and short addressing modes.
Table 18. ST7 Addressing Mode Overview
Mode Inherent Immediate Short Long No Offset Short Long Short Long Short Long Relative Relative Bit Bit Bit Direct Direct Direct Direct Direct Indirect Indirect Indirect Indirect Direct Indirect Direct Indirect Direct Relative Indexed Indexed Indexed Indexed Indexed nop ld A,#$55 ld A,$10 ld A,$1000 ld A,(X) ld A,($10,X) ld A,($1000,X) ld A,[$10] ld A,[$10.w] ld A,([$10],X) ld A,([$10.w],X) jrne loop jrne [$10] bset $10,#7 bset [$10],#7 btjt $10,#7,skip 00..FF 0000..FFFF 00..FF 00..1FE 0000..FFFF 00..FF 0000..FFFF 00..1FE 0000..FFFF PC-128/PC+1271) PC-128/PC+1271) 00..FF 00..FF 00..FF 00..FF 00..FF byte byte 00..FF 00..FF 00..FF 00..FF byte word byte word Syntax Destination/ Source Pointer Address (Hex.) Pointer Size (Hex.) +0 +1 +1 +2 + 0 (with X register) + 1 (with Y register) +1 +2 +2 +2 +2 +2 +1 +2 +1 +2 +2 Length (Bytes)
Bit Indirect Relative btjt [$10],#7,skip 00..FF 00..FF byte +3 Note: 1. At the time the instruction is executed, the Program Counter (PC) points to the instruction following JRxx.
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ST7 ADDRESSING MODES (Cont'd) 12.1.1 Inherent All Inherent instructions consist of a single byte. The opcode fully specifies all the required information for the CPU to process the operation.
Inherent Instruction NOP TRAP WFI HALT RET IRET SIM RIM SCF RCF RSP LD CLR PUSH/POP INC/DEC TNZ CPL, NEG MUL SLL, SRL, SRA, RLC, RRC SWAP Function No operation S/W Interrupt Wait For Interrupt (Low Power Mode) Halt Oscillator (Lowest Power Mode) Subroutine Return Interrupt Subroutine Return Set Interrupt Mask Reset Interrupt Mask Set Carry Flag Reset Carry Flag Reset Stack Pointer Load Clear Push/Pop to/from the stack Increment/Decrement Test Negative or Zero 1 or 2 Complement Byte Multiplication Shift and Rotate Operations Swap Nibbles
12.1.2 Immediate Immediate instructions have 2 bytes, the first byte contains the opcode, the second byte contains the operand value.
Immediate Instruction LD CP BCP AND, OR, XOR ADC, ADD, SUB, SBC Load Compare Bit Compare Logical Operations Arithmetic Operations Function
12.1.3 Direct In Direct instructions, the operands are referenced by their memory address. The direct addressing mode consists of two submodes: Direct (Short) The address is a byte, thus requires only 1 byte after the opcode, but only allows 00 - FF addressing space. Direct (Long) The address is a word, thus allowing 64 Kbyte addressing space, but requires 2 bytes after the opcode. 12.1.4 Indexed (No Offset, Short, Long) In this mode, the operand is referenced by its memory address, which is defined by the unsigned addition of an index register (X or Y) with an offset. The indirect addressing mode consists of three submodes: Indexed (No Offset) There is no offset (no extra byte after the opcode), and allows 00 - FF addressing space. Indexed (Short) The offset is a byte, thus requires only 1 byte after the opcode and allows 00 - 1FE addressing space. Indexed (Long) The offset is a word, thus allowing 64 Kbyte addressing space and requires 2 bytes after the opcode. 12.1.5 Indirect (Short, Long) The required data byte to do the operation is found by its memory address, located in memory (pointer). The pointer address follows the opcode. The indirect addressing mode consists of two submodes: Indirect (Short) The pointer address is a byte, the pointer size is a byte, thus allowing 00 - FF addressing space, and requires 1 byte after the opcode. Indirect (Long) The pointer address is a byte, the pointer size is a word, thus allowing 64 Kbyte addressing space, and requires 1 byte after the opcode.
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ST7 ADDRESSING MODES (Cont'd) 12.1.6 Indirect Indexed (Short, Long) This is a combination of indirect and short indexed addressing modes. The operand is referenced by its memory address, which is defined by the unsigned addition of an index register value (X or Y) with a pointer value located in memory. The pointer address follows the opcode. The indirect indexed addressing mode consists of two submodes: Indirect Indexed (Short) The pointer address is a byte, the pointer size is a byte, thus allowing 00 - 1FE addressing space, and requires 1 byte after the opcode. Indirect Indexed (Long) The pointer address is a byte, the pointer size is a word, thus allowing 64 Kbyte addressing space, and requires 1 byte after the opcode. Table 19. Instructions Supporting Direct, Indexed, Indirect and Indirect Indexed Addressing Modes
Long and Short Instructions LD CP AND, OR, XOR ADC, ADD, SUB, SBC BCP Load Compare Logical Operations Arithmetic Addition/subtraction operations Bit Compare Function
12.1.7 Relative Mode (Direct, Indirect) This addressing mode is used to modify the PC register value by adding an 8-bit signed offset to it.
Available Relative Direct/ Indirect Instructions JRxx CALLR Function Conditional Jump Call Relative
The relative addressing mode consists of two submodes: Relative (Direct) The offset follows the opcode. Relative (Indirect) The offset is defined in memory, of which the address follows the opcode.
Short Instructions Only CLR INC, DEC TNZ CPL, NEG BSET, BRES BTJT, BTJF SLL, SRL, SRA, RLC, RRC SWAP CALL, JP Clear
Function Increment/Decrement Test Negative or Zero 1 or 2 Complement Bit Operations Bit Test and Jump Operations Shift and Rotate Operations Swap Nibbles Call or Jump subroutine
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12.2 INSTRUCTION GROUPS The ST7 family devices use an Instruction Set consisting of 63 instructions. The instructions may
Load and Transfer Stack operation Increment/Decrement Compare and Tests Logical operations Bit Operation Conditional Bit Test and Branch Arithmetic operations Shift and Rotates Unconditional Jump or Call Conditional Branch Interruption management Condition Code Flag modification LD PUSH INC CP AND BSET BTJT ADC SLL JRA JRxx TRAP SIM WFI RIM HALT SCF IRET RCF CLR POP DEC TNZ OR BRES BTJF ADD SRL JRT SUB SRA JRF SBC RLC JP MUL RRC CALL SWAP CALLR SLA NOP RET BCP XOR CPL NEG RSP
be subdivided into 13 main groups as illustrated in the following table:
Using a prebyte The instructions are described with 1 to 4 bytes. In order to extend the number of available opcodes for an 8-bit CPU (256 opcodes), three different prebyte opcodes are defined. These prebytes modify the meaning of the instruction they precede. The whole instruction becomes: PC-2 End of previous instruction PC-1 Prebyte PC Opcode PC+1 Additional word (0 to 2) according to the number of bytes required to compute the effective address These prebytes enable instruction in Y as well as indirect addressing modes to be implemented. They precede the opcode of the instruction in X or the instruction using direct addressing mode. The prebytes are:
PDY 90 Replace an X based instruction using immediate, direct, indexed, or inherent addressing mode by a Y one. PIX 92 Replace an instruction using direct, direct bit or direct relative addressing mode to an instruction using the corresponding indirect addressing mode. It also changes an instruction using X indexed addressing mode to an instruction using indirect X indexed addressing mode. PIY 91 Replace an instruction using X indirect indexed addressing mode by a Y one. 12.2.1 Illegal Opcode Reset In order to provide enhanced robustness to the device against unexpected behavior, a system of illegal opcode detection is implemented. If a code to be executed does not correspond to any opcode or prebyte value, a reset is generated. This, combined with the Watchdog, allows the detection and recovery from an unexpected fault or interference. Note: A valid prebyte associated with a valid opcode forming an unauthorized combination does not generate a reset.
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INSTRUCTION GROUPS (Cont'd)
Mnemo ADC ADD AND BCP BRES BSET BTJF BTJT CALL CALLR CLR CP CPL DEC HALT IRET INC JP JRA JRT JRF JRIH JRIL JRH JRNH JRM JRNM JRMI JRPL JREQ JRNE JRC JRNC JRULT JRUGE JRUGT Description Add with Carry Addition Logical And Bit compare A, Memory Bit Reset Bit Set Jump if bit is false (0) Jump if bit is true (1) Call subroutine Call subroutine relative Clear Arithmetic Compare One Complement Decrement Halt Interrupt routine return Increment Absolute Jump Jump relative always Jump relative Never jump Jump if ext. interrupt = 1 Jump if ext. interrupt = 0 Jump if H = 1 Jump if H = 0 Jump if I = 1 Jump if I = 0 Jump if N = 1 (minus) Jump if N = 0 (plus) Jump if Z = 1 (equal) Jump if Z = 0 (not equal) Jump if C = 1 Jump if C = 0 Jump if C = 1 Jump if C = 0 Jump if (C + Z = 0) H=1? H=0? I=1? I=0? N=1? N=0? Z=1? Z=0? C=1? C=0? Unsigned < Jmp if unsigned >= Unsigned > jrf * Pop CC, A, X, PC inc X jp [TBL.w] reg, M H tst(Reg - M) A = FFH-A dec Y reg, M reg reg, M reg, M 0 I N N Z Z C M 0 N N N 1 Z Z Z C 1 Function/Example A=A+M+C A=A+M A=A.M tst (A . M) bres Byte, #3 bset Byte, #3 btjf Byte, #3, Jmp1 btjt Byte, #3, Jmp1 A A A A M M M M C C Dst M M M M Src H H H I N N N N N Z Z Z Z Z C C C
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INSTRUCTION GROUPS (Cont'd)
Mnemo JRULE LD MUL NEG NOP OR POP Description Jump if (C + Z = 1) Load Multiply Negate (2's compl) No Operation OR operation Pop from the Stack A=A+M pop reg pop CC PUSH RCF RET RIM RLC RRC RSP SBC SCF SIM SLA SLL SRL SRA SUB SWAP TNZ TRAP WFI XOR Push onto the Stack Reset carry flag Subroutine Return Enable Interrupts Rotate left true C Rotate right true C Reset Stack Pointer Subtract with Carry Set carry flag Disable Interrupts Shift left Arithmetic Shift left Logic Shift right Logic Shift right Arithmetic Subtraction SWAP nibbles Test for Neg & Zero S/W trap Wait for Interrupt Exclusive OR A = A XOR M A M I=0 C <= Dst <= C C => Dst => C S = Max allowed A=A-M-C C=1 I=1 C <= Dst <= 0 C <= Dst <= 0 0 => Dst => C Dst7 => Dst => C A=A-M reg, M reg, M reg, M reg, M A M 1 N N 0 N N N N 1 0 N Z Z Z Z Z Z Z Z C C C C C A M N Z C 1 reg, M reg, M 0 N N Z Z C C push Y C=0 A reg CC M M M M reg, CC 0 H I N Z C N Z Function/Example Unsigned <= dst <= src X,A = X * A neg $10 reg, M A, X, Y reg, M M, reg X, Y, A 0 N Z N Z 0 C Dst Src H I N Z C
Dst[7..4] <=> Dst[3..0] reg, M tnz lbl1 S/W interrupt
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13 ELECTRICAL CHARACTERISTICS
13.1 PARAMETER CONDITIONS Unless otherwise specified, all voltages are referred to VSS. 13.1.1 Minimum and Maximum Values Unless otherwise specified, the minimum and maximum values are guaranteed in the worst conditions of ambient temperature, supply voltage and frequencies by tests in production on 100% of the devices with an ambient temperature at TA = 25C and TA = TAmax (given by the selected temperature range). Data based on characterization results, design simulation and/or technology characteristics are indicated in the table footnotes and are not tested in production. Based on characterization, the minimum and maximum values refer to sample tests and represent the mean value plus or minus three times the standard deviation (mean 3). 13.1.2 Typical Values Unless otherwise specified, typical data is based on TA = 25C, VDD = 5V (for the 4.5V VDD 5.5V (for the voltage range), VDD = 3.3V 3V VDD 3.6V voltage range). They are given only as design guidelines and are not tested. 13.1.3 Typical Curves Unless otherwise specified, all typical curves are given only as design guidelines and are not tested. 13.1.4 Loading Capacitor The loading conditions used for pin parameter measurement are shown in Figure 40. Figure 40. Pin Loading Conditions 13.1.5 Pin Input Voltage The input voltage measurement on a pin of the device is described in Figure 41. Figure 41. Pin Input Voltage
ST7 PIN
VIN
ST7 PIN
CL
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13.2 ABSOLUTE MAXIMUM RATINGS Stresses above those listed as "absolute maximum ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device under these condi13.2.1 Voltage Characteristics
Symbol VDD - VSS VIN VESD(HBM) VESD(MM) Supply voltage Input voltage on any pin1)2) Electrostatic discharge voltage (Human Body Model) Electrostatic discharge voltage (Machine Model) Ratings
tions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
Maximum value 7.0 VSS - 0.3 to VDD + 0.3
Unit V
see Section 13.7.2 on page 82 see Section 13.7.2 on page 82
13.2.2 Current Characteristics
Symbol IVDD IVSS IIO Ratings Total current into VDD power lines (source)3) Total current out of VSS ground lines (sink)3) Output current sunk by any standard I/O and control pin Output current sunk by any high sink I/O pin Output current source by any I/Os and control pin IINJ(PIN)2)4) Injected current on RESET pin Injected current on PB1 pin5) Injected current on any other pin6) IINJ(PIN)2) Total injected current (sum of all I/O and control pins)6) Maximum value 75 150 20 40 -25 5 +5 5 20 mA Unit
13.2.3 Thermal Characteristics
Symbol TSTG TJ Ratings Storage temperature range Value -65 to +150 Unit C
Maximum junction temperature (see Section 14.2 THERMAL CHARACTERISTICS)
Notes: 1. Directly connecting the I/O pins to VDD or VSS could damage the device if an unexpected change of the I/O configuration occurs (for example, due to a corrupted program counter). To guarantee safe operation, this connection must be done through a pull-up or pull-down resistor (typical: 10k for I/Os). Unused I/O pins must be tied in the same way to VDD or VSS according to their reset configuration. For reset pin, please refer to Figure 64. 2. IINJ(PIN) must never be exceeded. This is implicitly insured if VIN maximum is respected. If VIN maximum cannot be respected, the injection current must be limited externally to the IINJ(PIN) value. A positive injection is induced by VIN > VDD while a negative injection is induced by VIN < VSS. 3. All power (VDD) and ground (VSS) lines must always be connected to the external supply. 4. Negative injection disturbs the analog performance of the device. In particular, it induces leakage currents throughout the device including the analog inputs. To avoid undesirable effects on the analog functions, care must be taken: - Analog input pins must have a negative injection less than 0.8mA (assuming that the impedance of the analog voltage is lower than the specified limits) - Pure digital pins must have a negative injection less than 1.6mA. In addition, it is recommended to inject the current as far as possible from the analog input pins. 5. No negative current injection allowed on PB1 pin. 6. When several inputs are submitted to a current injection, the maximum IINJ(PIN) is the absolute sum of the positive and negative injected currents (instantaneous values). These results are based on characterization with IINJ(PIN) maximum current injection on four I/O port pins of the device.
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13.3 OPERATING CONDITIONS 13.3.1 General Operating Conditions TA = -40 to +105C, unless otherwise specified.
Symbol VDD fCLKIN TA Parameter Supply voltage External clock frequency on CLKIN pin Ambient temperature range Conditions fOSC = 16 MHz max TA = -40C to TA max VDD 3V A Suffix version B Suffix version Min 3.0 0 -40 Max 5.5 16 +85 +105 Unit V MHz C
Figure 42. fCLKIN Maximum Operating Frequency Versus VDD Supply Voltage
fCLKIN [MHz] FUNCTIONALITY GUARANTEED IN THIS AREA (UNLESS OTHERWISE STATED IN THE TABLES OF PARAMETRIC DATA). REFER TO Section 13.3.2 on page 75 FOR PLL OPERATING RANGE
16 FUNCTIONALITY NOT GUARANTEED IN THIS AREA 8 4 1 0 2.0 3.0 3.3 3.5 4.0 4.5 5.0 5.5
SUPPLY VOLTAGE [V]
Note: For further information on clock management and fCLKIN description, refer to Figure 12 in Section 7 on page 23. 13.3.2 Internal RC Oscillator and PLL The ST7 internal clock can be supplied by an internal RC oscillator and PLL (selectable by option byte).
Symbol Parameter Conditions VDD(RC) Internal RC oscillator operating voltage VDD(x8PLL) x8 PLL operating voltage tSTARTUP PLL startup time Min 3.0 3.6 Typ Max 5.5 60 Unit V PLL input clock (fPLL) cycles
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OPERATING CONDITIONS (Cont'd) The RC oscillator and PLL characteristics are temperature-dependent and are grouped in two tables. Operating conditions (tested for TA = -40 to +105C) @ VDD = 4.5 to 5.5V
Symbol fRC1) ACCRC IDD(RC) tsu(RC) fPLL tLOCK tSTAB ACCPLL JITPLL IDD(PLL) Conditions RCCR = FF (reset value), TA = 25C, VDD = 5V RCCR = RCCR02 ), TA = 25C, VDD = 5V TA = 25C, VDD = 5V Accuracy of internal RC oscillator when calibrated TA = 25C, VDD = 4.5 to 5.5V4) with RCCR = RCCR02)3) TA = -40 to +105C, VDD = 4.5 to 5.5V4) RC oscillator current TA = 25C, VDD = 5V consumption RC oscillator setup time TA = 25C, VDD = 5V x8 PLL input clock PLL lock time8) PLL stabilization time8) x8 PLL accuracy fRC = 1 MHz @ TA = -40 to +105C PLL jitter (fCPU/fCPU) PLL current consumption TA = 25C Internal RC oscillator frequency Parameter Min 995 -0.5 -1 -5 Typ 760 1000 Max 1005 +0.5 +1 +2 Unit kHz
%
9704)5) 102) 1 2 4 0.17) 16) 6004)
A s MHz ms % A
Notes: 1. If the RC oscillator clock is selected, to improve clock stability and frequency accuracy, it is recommended to place a decoupling capacitor, typically 100nF, between the VDD and VSS pins as close as possible to the ST7 device. 2. See "INTERNAL RC OSCILLATOR ADJUSTMENT" on page 23 3. Minimum value is obtained for hot temperature and maximum value is obtained for cold temperature. 4. Data based on characterization results, not tested in production. 5. Measurement made with RC calibrated at 1 MHz. 6. Guaranteed by design. 7. Averaged over a 4ms period. After the LOCKED bit is set, a period of tSTAB is required to reach ACCPLL accuracy. 8. After the LOCKED bit is set ACCPLL is max. 10% until tSTAB has elapsed. See Figure 11 on page 23.
Operating conditions (tested for TA = -40 to +105C) @ VDD = 3.0 to 3.6V1)
Symbol fRC ACCRC IDD(RC) tsu(RC) Parameter1) Internal RC oscillator frequency Conditions RCCR = FF (reset value), TA = 25C, VDD = 3.3V RCCR = RCCR13), TA = 25C, VDD = 3.3V -15 7005) 103) Min Typ 560 700 +15 Max Unit kHz
Accuracy of internal RC oscillator when calibrated TA = -40 to +105C with RCCR = RCCR13)4) RC oscillator current consumption RC oscillator setup time TA = 25C, VDD = 3.3V
% A s
Notes: 1 Data based on characterization results, not tested in production. 2 If the RC oscillator clock is selected, to improve clock stability and frequency accuracy, it is recommended to place a decoupling capacitor, typically 100nF, between the VDD and VSS pins as close as possible to the ST7 device. 3. See "INTERNAL RC OSCILLATOR ADJUSTMENT" on page 23. 4. Minimum value is obtained for hot temperature and maximum value is obtained for cold temperature. 5. Measurement made with RC calibration at 1 MHz. 6. Guaranteed by design. 7. Averaged over a 4ms period. After the LOCKED bit is set, a period of tSTAB is required to reach ACCPLL accuracy. 8. After the LOCKED bit is set ACCPLL is max. 10% until tSTAB has elapsed. See Figure 11 on page 23.
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OPERATING CONDITIONS (Cont'd) Figure 43. RC Osc Freq vs VDD (Calibrated with RCCR0: 5V@ 25C) Figure 45. RC Osc Freq vs VDD and RCCR Value
1.80
1.10 1.00 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0.00 2.5 3 3.5 4 4.5 5 5.5 6 Vdd (V)
1.60
-45 0 25 90 105 130
Output Freq. (MHz)
Output Freq. (MHz)
1.40 1.20 1.00 0.80 0.60 0.40 0.20 0.00 2.4 2.7 3 3.3 3.75 4 4.5 5 5.5 6 rccr=00h rccr=64h rccr=80h rccr=C0h rccr=FFh
Vdd (V)
Figure 44. Typical RC oscillator Accuracy vs temperature @ VDD = 5V (Calibrated with RCCR0: 5V @ 25C
Figure 46. PLLx8 Output vs CLKIN frequency
11.00 Output Frequency (MHz)
RC Accuracy
2 1 0
9.00 7.00 5.00 3.00 1.00 0.85 0.9 1 1.5 2 2.5 5.5 5 4.5 4
-1
-2 -3 -4 -5 -45 0 25
Temperature (C)
85
125
External Input Clock Frequency (MHz)
Note: fOSC = fCLKIN/2*PLL8
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13.4 SUPPLY CURRENT CHARACTERISTICS The following current consumption specified for the ST7 functional operating modes over temperature range does not take into account the clock source current consumption. To get the total de13.4.1 Supply Current TA = -40 to +105C, unless otherwise specified
Symbol Parameter Supply current in RUN mode Supply current in WAIT mode Supply current in SLOW mode Supply current in SLOW WAIT mode Supply current in HALT mode5) Supply current in ACTIVE HALT mode
vice consumption, the two current values must be added (except for HALT mode for which the clock is stopped).
IDD
Conditions fCPU = 8 MHz1) fCPU = 8 MHz2) fCPU = 250 kHz3) VDD = 5.5V fCPU = 250 kHz4) -40C TA +105C
Typ Max Unit 5.0 7.0 1.7 2.70 mA 0.6 1.0 0.5 0.9 0.5 10 A 600 1000
Notes: 1. CPU running with memory access, all I/O pins in input mode with a static value at VDD or VSS (no load), all peripherals in reset state; clock input (CLKIN) driven by external square wave. 2. All I/O pins in input mode with a static value at VDD or VSS (no load), all peripherals in reset state; clock input (CLKIN) driven by external square wave. 3. SLOW mode selected with fCPU based on fOSC divided by 32. All I/O pins in input mode with a static value at VDD or VSS (no load), all peripherals in reset state; clock input (CLKIN) driven by external square wave. 4. SLOW-WAIT mode selected with fCPU based on fOSC divided by 32. All I/O pins in input mode with a static value at VDD or VSS (no load), all peripherals in reset state; clock input (CLKIN) driven by external square wave. 5. All I/O pins in output mode with a static value at VSS (no load). Data based on characterization results, tested in production at VDD max and fCPU max.
Figure 47. Typical IDD in RUN vs fCPU
5.0 4.0
Figure 49. Typical IDD in WAIT vs fCPU
8MHz 4MHz Idd (mA)
1.5 1.0 0.5 0.0
8MHz 4MHz 1MHz
2.0
Idd (mA)
3.0 2.0 1.0 0.0 2.4
1MHz
2.7
3.7
4.5
5
5.5
2.4
2.7
3.7
4.5
5
5.5
Vdd (V)
Vdd (V)
Figure 48. Typical IDD in SLOW vs fCPU
0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0.00 2.4
Figure 50. Typical IDD in SLOW WAIT vs fCPU
0.70 0.60 0.50 0.40 0.30 0.20 0.10 0.00
250kHz 125kHz 62.5kHz
Idd (mA)
250kHz 125kHz 62.5kHz
Idd (mA)
2.7
3.7
4.5
5
5.5
2.4
2.7
3.7
4.5
5
5.5
Vdd (V)
Vdd (V)
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SUPPLY CURRENT CHARACTERISTICS (cont'd) Figure 51. Typical IDD vs Temperature at VDD = 5V and fCPU = 8 MHz
5.00 4.50 4.00 3.50 3.00 2.50 2.00 1.50 1.00 0.50 0.00 -45 25 90 130
RUN WAIT SLOW SLOW WAIT
Idd (mA)
Temperature (C)
13.4.2 On-chip peripherals
Symbol IDD(AT) IDD(SPI) IDD(ADC) Parameter 12-bit Autoreload Timer supply current1) SPI supply current2) ADC supply current when converting3) Conditions fCPU = 4 MHz VDD = 3.0V fCPU = 8 MHz VDD = 5.0V fCPU = 4 MHz VDD = 3.0V fCPU = 8 MHz VDD = 5.0V VDD = 3.0V fADC = 4 MHz VDD = 5.0V Typ 150 250 50 300 780 1100 Unit
A
Notes: 1. Data based on a differential IDD measurement between reset configuration (timer stopped) and a timer running in PWM mode at fCPU = 8 MHz 2. Data based on a differential IDD measurement between reset configuration and a permanent SPI master communication (data sent equal to 55h) 3. Data based on a differential IDD measurement between reset configuration and continuous A/D conversions
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13.5 CLOCK AND TIMING CHARACTERISTICS Subject to general operating conditions for VDD, fOSC and TA. 13.5.1 General Timings
Symbol tc(INST) tv(IT) Parameter1) Instruction cycle time Interrupt reaction time3) tv(IT) = tc(INST) + 10 Conditions fCPU = 8 MHz fCPU = 8 MHz Min 2 250 10 1.25 Typ2) 3 375 Max 12 1500 22 2.75 Unit tCPU ns tCPU s
Notes: 1. Guaranteed by Design. Not tested in production. 2. Data based on typical application software. 3. Time measured between interrupt event and interrupt vector fetch. Dtc(INST) is the number of tCPU cycles needed to finish the current instruction execution.
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13.6 MEMORY CHARACTERISTICS TA = -40 to +105C, unless otherwise specified 13.6.1 RAM and Hardware Registers
Symbol VRM Parameter Data retention mode1) Conditions HALT mode (or RESET) Min 1.6 Typ Max Unit V
13.6.2 Flash Program Memory
Symbol VDD Parameter Conditions Min 3.0 5 0.24 20 1K 300 2.65 100 0.1 Typ Max 5.5 10 0.48 Unit V ms s years cycles mA A Refer to operating range of V with TA, Table 13.3.1, Operating voltage for Flash write/erase DD "General Operating Conditions," on page 75 TA = -40 to +105C Programming time for 1~32 bytes2) TA = 25C Programming time for 1.5 Kbytes Data retention4) Write erase cycles TA = 55C3) TA = 25C TA = 105C Read / Write / Erase modes fCPU = 8 MHz, VDD = 5.5V No Read/No Write Mode Power down mode / HALT
tPROG tRET NRW
IDD
Supply current
0
13.6.3 EEPROM Data Memory
Symbol VDD tPROG Parameter Operating voltage for EEPROM write/ erase Programming time for 1~32 bytes Data retention with 1K cycling (TPROG = -40 to +105C) tRET4) Data retention with 10K cycling (TPROG TA = 55C3) = -40 to +105C) Data retention with 100K cycling (TPROG = -40 to +105C) Conditions Refer to operating range of VDD with TA, Table 13.3.1, "General Operating Conditions," on page 75 TA = -40 to +105C Min 3.0 5 20 10 1 years Typ Max 5.5 10 Unit V ms
Notes: 1. Minimum VDD supply voltage without losing data stored in RAM (in HALT mode or under RESET) or in hardware registers (only in HALT mode). Guaranteed by construction, not tested in production. 2. Up to 32 bytes can be programmed at a time. 3. The data retention time increases when the TA decreases. 4. Data based on reliability test results and monitored in production. 5. Guaranteed by Design. Not tested in production.
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13.7 EMC CHARACTERISTICS Susceptibility tests are performed on a sample basis during product characterization. 13.7.1 Functional EMS (Electro Magnetic Susceptibility) Based on a simple running application on the product (toggling 2 LEDs through I/O ports), the product is stressed by two electro magnetic events until a failure occurs (indicated by the LEDs). ESD: Electro-Static Discharge (positive and negative) is applied on all pins of the device until a functional disturbance occurs. This test conforms with the IEC 1000-4-2 standard. FTB: A Burst of Fast Transient voltage (positive and negative) is applied to VDD and VSS through a 100pF capacitor, until a functional disturbance occurs. This test conforms with the IEC 1000-44 standard. A device reset allows normal operations to resume. The test results are given in the table below based on the EMS levels and classes defined in application note AN1709. 13.7.1.1 Designing Hardened Software to Avoid Noise Problems EMC characterization and optimization are performed at component level with a typical applicaSymbol VFESD VFFTB Parameter Voltage limits to be applied on any I/O pin to induce a functional disturbance Fast transient voltage burst limits to be applied through 100pF on VDD and VDD pins to induce a functional disturbance
tion environment and simplified MCU software. It should be noted that good EMC performance is highly dependent on the user application and the software in particular. Therefore it is recommended that the user applies EMC software optimization and prequalification tests in relation with the EMC level requested for his application. Software recommendations: The software flowchart must include the management of runaway conditions such as: - Corrupted program counter - Unexpected reset - Critical Data corruption (control registers...) Prequalification trials: Most of the common failures (unexpected reset and program counter corruption) can be reproduced by manually forcing a low state on the RESET pin or the Oscillator pins for 1 second. To complete these trials, ESD stress can be applied directly on the device, over the range of specification values. When unexpected behavior is detected, the software can be hardened to prevent unrecoverable errors occurring (see application note AN1015).
Conditions VDD = 5V, TA = 25C, fOSC = 8 MHz conforms to IEC 1000-4-2 VDD = 5V, TA = 25C, fOSC = 8 MHz conforms to IEC 1000-4-4 Level/ Class 2B 3B
13.7.2 Electro Magnetic Interference (EMI) Based on a simple application running on the product (toggling two LEDs through the I/O ports), the product is monitored in terms of emission. This emission test is in line with the norm SAE J 1752/ 3 which specifies the board and the loading of each pin.
Symbol Parameter Conditions VDD = 5V, TA = 25C, SO16 package, conforming to SAE J 1752/3 Monitored Frequency Band 0.1 MHz to 30 MHz 30 MHz to 130 MHz 130 MHz to 1 GHz SAE EMI Level Max vs [fOSC/fCPU] 1/4 MHz 1/8 MHz 8 14 27 32 26 28 3.5 4 Unit
SEMI
Peak level1)
dBV -
Notes: 1. Data based on characterization results, not tested in production.
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EMC CHARACTERISTICS (Cont'd) 13.7.3 Absolute Maximum Ratings (Electrical Sensitivity) Based on three different tests (ESD, LU and DLU) using specific measurement methods, the product is stressed in order to determine its performance in terms of electrical sensitivity. For more details, refer to the application note AN1181.
13.7.3.1 Electro-Static Discharge (ESD) Electro-Static Discharges (a positive then a negative pulse separated by 1 second) are applied to the pins of each sample according to each pin combination. The sample size depends on the number of supply pins in the device (3 parts*(n+1) supply pin). Three models can be simulated: Human Body Model, Machine Model and Charge Device Model. This test conforms to the JESD22A114A/A115A standard.
Absolute Maximum Ratings
Symbol VESD(HBM) VESD(MM) VESD(CDM) Ratings Electro-static discharge voltage (Human Body Model) Electro-static discharge voltage (Machine Model) Electro-static discharge voltage (Charge Device Model) Conditions Maximum value1) 2000 TA = 25C 200 Pins 1, 8, 9 and 16 (TA = 25C) All other pins (TA = 25C) 750 500 V Unit
Notes: 1. Data based on characterization results, not tested in production.
13.7.3.2 Static and Dynamic Latch-Up LU: Three complementary static tests are required on 10 parts to assess the latch-up performance. A supply overvoltage (applied to each power supply pin) and a current injection (applied to each input, output and configurable I/O pin) are performed on each sample. This test conforms to the EIA/JESD 78 IC latch-up standard. For more details, refer to the application note AN1181. Electrical Sensitivities
Symbol LU DLU Parameter Static latch-up class Dynamic latch-up class
DLU: Electro-Static Discharges (one positive then one negative test) are applied to each pin of three samples when the micro is running to assess the latch-up performance in dynamic mode. Power supplies are set to the typical values, the oscillator is connected as near as possible to the pins of the micro and the component is put in reset mode. This test conforms to the IEC1000-4-2 and SAEJ1752/3 standards. For more details, refer to the application note AN1181.
Class1) A
Conditions TA = 25C, TA = 105C VDD = 5.5V, fOSC = 4 MHz, TA = 25C
Notes: 1. Class description: A Class is an STMicroelectronics internal specification. All its limits are higher than the JEDEC specifications, that means when a device belongs to Class A it exceeds the JEDEC standard. B Class strictly covers all the JEDEC criteria (international standard).
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13.8 I/O PORT PIN CHARACTERISTICS 13.8.1 General Characteristics Subject to general operating conditions for VDD, fOSC and TA (-40 to +105C), unless otherwise specified.
Symbol VIL VIH Vhys IL IS RPU CIO tf(IO)out tr(IO)out tw(IT)in Parameter Input low level voltage Input high level voltage Schmitt trigger voltage hysteresis1) Input leakage current VSS VIN VDD 400 50 120 5 CL = 50pF Between 10% and 90% 1 25 250 Static current consumption induced by Floating input mode each floating input pin2) Weak pull-up equivalent resistor3) I/O pin capacitance Output high to low level fall time1) Output low to high level rise time1) External interrupt pulse time4) VIN = VSS VDD = 5V Conditions Min VSS - 0.3 0.7xVDD 400 1 A k pF ns tCPU Typ Max 0.3 x VDD VDD + 0.3 mV Unit V
Notes: 1. Data based on characterization results, not tested in production. 2. Configuration not recommended, all unused pins must be kept at a fixed voltage: Using the output mode of the I/O for example or an external pull-up or pull-down resistor (see Figure 57). Static peak current value taken at a fixed VIN value, based on design simulation and technology characteristics, not tested in production. This value depends on VDD and temperature values. 3. The RPU pull-up equivalent resistor is based on a resistive transistor (corresponding IPU current characteristics described in Figure 53). 4. To generate an external interrupt, a minimum pulse width must be applied on an I/O port pin configured as an external interrupt source.
Figure 52. Two Typical Applications with Unused I/O Pin Configured as Input
VDD 10k
ST7XXX
UNUSED I/O PORT 10k
UNUSED I/O PORT
ST7XXX
Caution: During normal operation the ICCCLK pin must be pulled- up, internally or externally (external pull-up of 10k mandatory in noisy environment). This is to avoid entering ICC mode unexpectedly during a reset. Note: I/O can be left unconnected if it is configured as output (0 or 1) by the software. This has the advantage of greater EMC robustness and lower cost.
Figure 53. Typical IPU vs VDD with VIN = VSSl
90 80 70 60 Ipu(uA) 50 40 30 20 10 0 2 2.5 3 3.5 4 4.5 Vdd(V) 5 5.5 6
Ta=1 40C Ta=9 5C Ta=2 5C Ta=-45 C
TO BE CHARACTERIZED
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I/O PORT PIN CHARACTERISTICS (Cont'd) 13.8.2 Output Driving Current Subject to general operating conditions for VDD, fOSC and TA (-40 to +105C), unless otherwise specified.
Symbol Parameter Output low level voltage for a standard I/O pin when 8 pins are sunk at same time (see Figure 55) Output low level voltage for a high sink I/O pin when 4 pins are sunk at same time (see Figure 57) Output high level voltage for an I/O pin when 4 pins are sourced at same time (see Figure 60) VDD = 5V Conditions IIO = +5mA IIO = +2mA IIO = +20mA IIO = +8mA IIO = -5mA IIO = -2mA VDD - 1.5 VDD - 1.0 Min Typ 0.65 0.25 1.05 0.4 4.30 4.70 Max 1.0 0.4 1.4 0.75 V Unit
VOL1)
VOH2)
Notes: 1. The IIO current sunk must always respect the absolute maximum rating specified in Section 13.2.2 and the sum of IIO (I/O ports and control pins) must not exceed IVSS. 2. The IIO current sourced must always respect the absolute maximum rating specified in Section 13.2.2 and the sum of IIO (I/O ports and control pins) must not exceed IVDD. 3. Not tested in production, based on characterization results.
Figure 54. Typical VOL at VDD = 3.3V (standard)
0.70 0.60
Figure 56. Typical VOL at VDD = 5V (high-sink)
2.50
2.00 VOL at VDD=3.3V -45C 0C 25C 90C 130C Vol (V) at VDD=5V (HS) 0.50 0.40 0.30 0.20 0.10 0.00 0.01 1 lio (mA) 2 3
1.50
1.00
-45 0C 25C 90C 130C
0.50
0.00 6 7 8 9 10 15 lio (mA) 20 25 30 35 40
Figure 55. Typical VOL at VDD = 5V (standard)
Figure 57. Typical VOL at VDD = 3V (high-sink)
1.20
0.80 0.70 VOL at VDD=5V 0.60 0.50 0.40 0.30 0.20 0.10 0.00 0.01 1 2 lio (mA) 3 4 5 -45C 0C 25C 90C 130C
1.00 Vol (V) at VDD=3V (HS) 0.80 0.60 0.40 0.20 0.00 6 7 8 9 lio (mA) 10 15 -45 0C 25C 90C 130C
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I/O PORT PIN CHARACTERISTICS (Cont'd) Figure 58. Typical VDD-VOH at VDD = 3V
1.60 1.40 VDD-VOH at VDD=3V 1.20 1.00 0.80 0.60 0.40 0.20 0.00 -0.01 -1 lio (mA) -2 -3 -45C 0C 25C 90C 130C
Figure 60. Typical VDD-VOH at VDD = 5V
2.00 1.80 VDD-VOH at VDD=5V 1.60 1.40 1.20 1.00 0.80 0.60 0.40 0.20 0.00 -0.01 -1 -2 lio (mA) -3 -4 -5 -45C 0C 25C 90C 130C
TO BE CHARACTERIZED
Figure 59. Typical VDD-VOH at VDD = 4V
2.50
2.00 VDD-VOH at VDD=4V -45C 0C 25C 90C 130C
1.50
1.00
0.50
0.00 -0.01 -1 -2 lio (mA) -3 -4 -5
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I/O PORT PIN CHARACTERISTICS (Cont'd) Figure 61. Typical VOL vs VDD (standard I/Os)
0.70 0.60 0.50 0.40 0.30 0.20 0.10 0.00 2.4 2.7 VDD (V) 3.3 5 -45 0C 25C 90C 130C Vol (V) at lio=0.01mA Vol (V) at lio=2mA
0.06 0.05 0.04 0.03 0.02 0.01 0.00 2.4 2.7 VDD (V) 3.3 5 -45 0C 25C 90C 130C
Figure 62. Typical VOL vs VDD (high-sink I/Os)
0.70
1.00 VOL vs VDD (HS) at lio=20mA 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0.00
2.4 3 VDD (V) 5
VOL vs VDD (HS) at lio=8mA
0.60 0.50 0.40 0.30 0.20 0.10 0.00 -45 0C 25C 90C 130C
-45 0C 25C 90C 130C
2.4
3 VDD (V)
5
Figure 63. Typical VDD-VOH vs VDD
1,80 1,70 1,60 VDD-VOH at lio=-5mA 1,50 1,40 1,30 1,20 1,10 1,00 0,90 0,80 4 VDD (V) 5 -45C 0C 25C 90C 130C
1.10 VDD-VOH (V) at lio=-2mA 1.00 0.90 0.80 0.70 0.60 0.50 0.40 2.4 2.7 3 VDD (V) 4 5 -45C 0C 25C 90C 130C
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13.9 CONTROL PIN CHARACTERISTICS 13.9.1 Asynchronous RESET Pin TA = -40 to +105C, unless otherwise specified
Symbol VIL VIH Vhys Parameter Input low level voltage Input high level voltage Schmitt trigger voltage hysteresis1) IIO = +5mA VOL RON tw(RSTL)ou
t
Conditions
Min VSS - 0.3 0.7 x VDD
Typ
Max 0.3 x VDD VDD + 0.3
Unit
2 TA 85C TA 105C TA 85C TA 105C 20 0.5 0.2 40 30 20 200 ns 1.05) 1.25) 0.45) 0.55) 80 k s V
Output low level voltage Pull-up equivalent resistor3)1) Generated reset pulse duration External reset pulse hold time4) Filtered glitch duration
VDD = 5V IIO = +2mA VDD = 5V Internal reset sources
th(RSTL)in tg(RSTL)in
Notes: 1. Data based on characterization results, not tested in production. 2. The IIO current sunk must always respect the absolute maximum rating specified in Section 13.2.2 on page 74 and the sum of IIO (I/O ports and control pins) must not exceed IVSS. 3. The RON pull-up equivalent resistor is based on a resistive transistor. Specified for voltages on RESET pin between VILmax and VDD 4. To guarantee the reset of the device, a minimum pulse must be applied to the RESET pin. All short pulses applied on RESET pin with a duration below th(RSTL)in can be ignored. 5. Guaranteed by design, not tested in production
Figure 64. RESET Pin Protection1)
VDD
ST72XXX
USER EXTERNAL RESET CIRCUIT 0.01F
RON
Filter
INTERNAL RESET
PULSE GENERATOR
WATCHDOG ILLEGAL OPCODE2)
Notes: 1. The reset network protects the device against parasitic resets. The output of the external reset circuit must have an open-drain output to drive the ST7 reset pad. Otherwise the device can be damaged when the ST7 generates an internal reset (watchdog). - Whatever the reset source is (internal or external), the user must ensure that the level on the RESET pin can go below the VIL max. level specified in Section 13.9.1 on page 88. Otherwise the reset will not be taken into account internally. - Because the reset circuit is designed to allow the internal RESET to be output in the RESET pin, the user must ensure that the current sunk on the RESET pin is less than the absolute maximum value specified for IINJ(RESET) in Section 13.2.2 on page 74. 2. Please refer to "Illegal Opcode Reset" on page 70 for more details on illegal opcode reset conditions
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13.10 COMMUNICATION CHARACTERISTICS INTERFACE Refer to I/O port characteristics for more details on the input/output alternate function characteristics (SS, SCK, MOSI, MISO).
13.10.1 SPI - Serial Peripheral Interface Subject to general operating conditions for VDD, fOSC and TA, unless otherwise specified.
Symbol fSCK = 1/tc(SCK) tr(SCK) tf(SCK) tsu(SS)
1)
Parameter SPI clock frequency SPI clock rise and fall time SS setup time SS hold time SCK high and low time Data input setup time Data input hold time Data output access time Data output disable time Data output valid time Data output hold time Data output valid time Data output hold time Slave Master Slave Master Slave Master Slave Slave Slave
Conditions Master (fCPU = 8 MHz) Slave (fCPU = 8 MHz)
Min fCPU/128 = 0.0625 0
Max fCPU/4 = 2 fCPU/2 = 4
Unit MHz
see I/O port pin description 120 100 90 100 100 0 120 240 120 0 120 0 ns
th(SS)1) tw(SCKH) tw(SCKL)1) tsu(MI)1) tsu(SI)1) th(MI)1) th(SI)1) ta(SO)
1) 1)
tdis(SO)1) tv(SO)1) th(SO)1) tv(MO)
1)
Slave (after enable edge) Master (after enable edge)
th(MO)1)
Figure 65. SPI Slave Timing Diagram with CPHA = 03)
SS INPUT tsu(SS)
SCK INPUT
tc(SCK)
th(SS)
CPHA = 0 CPOL = 0 CPHA = 0 CPOL = 1 ta(SO) tw(SCKH) tw(SCKL) tv(SO) th(SO) tr(SCK) tf(SCK)
LSB OUT
tdis(SO)
See note 2
MISO OUTPUT
See note 2
MSB OUT
BIT6 OUT
tsu(SI)
th(SI)
MOSI INPUT
MSB IN
BIT1 IN
LSB IN
Notes: 1. Data based on design simulation and/or characterization results, not tested in production. 2. When no communication is on-going, the data output line of the SPI (MOSI in master mode, MISO in slave mode) has its alternate function capability released. In this case, the pin status depends on the I/O port configuration. 3. Measurement points are done at CMOS levels: 0.3 x VDD and 0.7 x VDD.
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COMMUNICATION INTERFACE CHARACTERISTICS (Cont'd) Figure 66. SPI Slave Timing Diagram with CPHA = 11)
SS INPUT tsu(SS)
SCK INPUT
tc(SCK)
th(SS)
CPHA = 1 CPOL = 0 CPHA = 1 CPOL = 1 ta(SO) tw(SCKH) tw(SCKL) tv(SO) th(SO) tr(SCK) tf(SCK)
LSB OUT
tdis(SO)
MISO OUTPUT
see note 2
HZ
MSB OUT
BIT6 OUT
see note 2
tsu(SI)
th(SI)
MOSI INPUT
MSB IN
BIT1 IN
LSB IN
Figure 67. SPI Master Timing Diagram1)
SS INPUT tc(SCK) CPHA = 0 CPOL = 0
SCK INPUT
CPHA = 0 CPOL = 1 CPHA = 1 CPOL = 0 CPHA = 1 CPOL = 1 tw(SCKH) tw(SCKL) tsu(MI) th(MI) tr(SCK) tf(SCK)
MISO INPUT
MSB IN
BIT6 IN
LSB IN
tv(MO)
th(MO)
MOSI OUTPUT
See note 2
MSB OUT
BIT6 OUT
LSB OUT
See note 2
Notes: 1. Measurement points are done at CMOS levels: 0.3xVDD and 0.7xVDD. 2. When no communication is on-going the data output line of the SPI (MOSI in master mode, MISO in slave mode) has its alternate function capability released. In this case, the pin status depends of the I/O port configuration.
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ADC CHARACTERISTICS (Cont'd) 13.11 8-BIT ADC CHARACTERISTICS Subject to general operating conditions for VDD, fOSC and TA (-40 to +105C), unless otherwise specified.
Symbol fADC VAIN RAIN CADC tSTAB tCONV tSAMPLE tHOLD Parameter ADC clock frequency Conversion voltage range External input resistor Internal sample and hold capacitor Stabilization time after ADC enable Conversion time (tSAMPLE + tHOLD) Sample capacitor loading time Hold conversion time fCPU = 8 MHz, fADC = 4 MHz VDD = 5V 3 04) 3 4 8 VSS Conditions Min2) Typ1) Max2) 4 VDD 103) Unit MHz V k pF s 1/fADC
Notes: 1. Unless otherwise specified, typical data is based on TA = 25C and VDD - VSS = 5V. They are given only as design guidelines and are not tested. 2. Data based on characterization results, not tested in production. 3. Any added external serial resistor will downgrade the ADC accuracy (especially for resistance greater than 10k). Data based on characterization results, not tested in production. 4. The stabilization time of the AD converter is masked by the first tLOAD. The first conversion after the enable is then always valid.
Figure 68. Typical Application with ADC
VDD VT 0.6V RAIN VAIN
CAIN
AINx VT 0.6V
2k(max)
8-bit A/D Conversion CADC 3pF
IL 1A
ST7XX
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ADC CHARACTERISTICS (Cont'd) Figure 69. RAIN max. vs fADC with CAIN = 0pF1)
45 40
Figure 70. Recommended CAIN/RAIN values2)
1000
Cain 10 nF 4 MHz Max. RAIN (Kohm) 2 MHz 1 MHz
100
Max. RAIN (Kohm)
35 30 25 20 15 10 5 0 0 10 30
Cain 22 nF Cain 47 nF
10
1
0.1 70 0.01 0.1 1 10
CPARASITIC (pF)
fAIN(KHz)
Notes: 1.CPARASITIC represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the pad capacitance (3pF). A high CPARASITIC value will downgrade conversion accuracy. To remedy this, fADC must be reduced. 2. This graph shows that depending on the input signal variation (fAIN), CAIN can be increased for stabilization and to allow the use of a larger serial resistor (RAIN). It is valid for all fADC frequencies 4 MHz.
13.11.0.1 General PCB Design Guidelines To obtain best results, some general design and layout rules must be followed when designing the application PCB to shield the noise-sensitive, analog physical interface from noise-generating CMOS logic signals. - Properly place components and route the signal traces on the PCB to shield the analog inputs.
Analog signals paths should run over the analog ground plane and be as short as possible. Isolate analog signals from digital signals that may switch while the analog inputs are being sampled by the A/D converter. Do not toggle digital outputs on the same I/O port as the A/D input being converted.
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ADC CHARACTERISTICS (Cont'd) TA = -40 to +105C unless otherwise specified Table 20. ADC Accuracy with 3.0V VDD 3.6V
Symbol | ET | | EO | | EG | | ED | | EL | Offset error Gain error Differential linearity error Integral linearity error fCPU = 4 MHz, fADC = 2 MHz1)2) Parameter Total unadjusted error Conditions Typ 0.7 0.3 0.4 0.5 0.4 Max3) 1.8 0.9 1.4 0.8 0.8 LSB Unit
Table 21. ADC Accuracy with 4.5V VDD 5.5V
Symbol | ET | | EO | | EG | | ED | | EL | Offset error Gain error Differential linearity error Integral linearity error fCPU = 8 MHz, fADC = 4 MHz1)2) Parameter Total unadjusted error Conditions Typ 0.9 0.3 0.6 0.5 0.5 Max3) 2.1 0.9 1.5 0.9 0.8 LSB Unit
Notes: 1. Data based on characterization results over the whole temperature range, monitored in production. 2. ADC accuracy versus negative injection current: Injecting negative current on any of the analog input pins may reduce the accuracy of the conversion being performed on another analog input. The effect of negative injection current on robust pins is specified in Section 13.11 on page 91. Any positive injection current within the limits specified for IINJ(PIN) and IINJ(PIN) in Section 13.8 does not affect the ADC accuracy. 3. Data based on characterization results, monitored in production to guarantee 99.73% within max value from -40 to +105C ( 3 distribution limits).
Figure 71. ADC Accuracy Characteristics
Digital Result ADCDR
255 254 253
EG
V -V DDA SSA = ---------------------------------------1LSB IDEAL 256 (2) ET
(1) Example of an actual transfer curve (2) The ideal transfer curve (3) End point correlation line
ET=Total Unadjusted Error: maximum deviation between the actual and the ideal transfer curves. EO=Offset Error: deviation between the first actual transition and the first ideal one. EG=Gain Error: deviation between the last ideal transition and the last actual one. ED=Differential Linearity Error: maximum deviation between actual steps and the ideal one. EL=Integral Linearity Error: maximum deviation between any actual transition and the end point correlation line.
7 6 5 4 3 2 1
(3) (1)
EO
EL ED 1 LSBIDEAL
0 1 VSSA
Vin (LSBIDEAL)
2
3
4
5
6
7
253 254 255 256 VDDA
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14 PACKAGE CHARACTERISTICS
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard 14.1 PACKAGE MECHANICAL DATA Figure 72. 16-Pin Plastic Small Outline Package, 150-mil Width JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com.
L 45x
Dim. A
mm Min Typ Max Min
inches Typ Max
1.35 0.10 0.33 0.19 9.80 3.80 1.27 5.80 0 0.40
1.75 0.053 0.25 0.004 0.51 0.013 0.25 0.007 10.00 0.386 4.00 0.150 0.050 6.20 0.228 8 0 1.27 0.016
Number of Pins
0.069 0.010 0.020 0.010 0.394 0.157 0.244 8 0.050
A1 B
A H A1 C
A1 B C D E e H
e
D
16
9 E
L N
0016020
1
8
16
14.2 THERMAL CHARACTERISTICS
Symbol RthJA TJmax PDmax Ratings Package thermal resistance (junction to ambient) Maximum junction temperature1) Power dissipation2) Value 95 150 500 Unit C/W C mW
Notes: 1. The maximum chip-junction temperature is based on technology characteristics. 2. The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA. The power dissipation of an application can be defined by the user with the formula: PD = PINT + PPORT where PINT is the chip internal power (IDD x VDD) and PPORT is the port power dissipation depending on the ports used in the application.
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PACKAGE CHARACTERISTICS (Cont'd) 14.3 SOLDERING INFORMATION In accordance with the RoHS European directive, all STMicroelectronics packages have been converted to lead-free technology named ECOPACKTM. ECOPACKTM packages are qualified according to the JEDEC STD-020C compliant soldering profile. Detailed information on the STMicroelectronics ECOPACKTM transition program is available on www.st.com/stonline/leadfree/, with specific technical application notes covering the main technical aspects related to lead-free conversion (AN2033, AN2034, AN2035, and AN2036). Forward compatibility ECOPACKTM SO packages are fully compatible with a lead (Pb) containing soldering process (see application note AN2034).
Table 22. Soldering Compatibility (Wave and Reflow Soldering Process)
Package SO Plating material NiPdAu (Nickel-Palladium-Gold) Pb solder paste Yes Pb-free solder paste Yes
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15 DEVICE CONFIGURATION AND ORDERING INFORMATION
15.1 INTRODUCTION Each device is available for production in user programmable versions (Flash) as well as in factory coded versions (FASTROM). The ST7PL0x device is a Factory Advanced Service Technique ROM (FASTROM) version: It is a factory-programmed XFlash device. The ST7FL0x XFlash device is shipped to customers with a default program memory content (FFh). The OSC option bit is programmed to 0 by default. The FASTROM factory coded parts contain the code supplied by the customer. This implies that Flash devices have to be configured by the customer using the Option Bytes while the FASTROM devices are factory-configured. 15.2 OPTION BYTES The two option bytes allow the hardware configuration of the microcontroller to be selected. The option bytes can be accessed only in programming mode (for example, using a standard ST7 programming tool). OPTION BYTE 0 Bits 7:4 = Reserved, must always be 1 Bits 3:2 = SEC[1:0] Sector 0 size definition These option bits indicate the size of sector 0 according to the following table:
Sector 0 Size 0.5k 1k 1.5k SEC1 0 0 1 SEC0 0 1 x
Bit 1 = FMP_R Read-out protection Read-out protection, when selected provides a protection against program memory content extraction and against write access to Flash memory. Erasing the option bytes when the FMP_R option is selected will cause the whole memory to be erased first, and the device can be reprogrammed. Refer to Section 4.5 and the ST7 Flash Programming Reference Manual for more details. 0: Read-out protection off 1: Read-out protection on Bit 0 = FMP_W FLASH write protection This option indicates if the Flash program memory is write protected. Warning: When this option is selected, the program memory (and the option bit itself) can never be erased or programmed again. 0: Write protection off 1: Write protection on
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DEVICE CONFIGURATION AND ORDERING INFORMATION (Cont'd) OPTION BYTE 1 Bit 7 = Reserved, must always be 1 Bit 6 = PLLOFF PLL disabled 0: PLL enabled 1: PLL disabled (by-passed) Bit 5 = Reserved, must always be 1 Table 23. List of Valid Option Combinations
VDD range 3.6 to 5.5V External clock Operating conditions Clock Source Internal RC 1% PLL off x8 off x8 Typ fCPU 1 MHz @ 5V 8 MHz @ 5V 0 to 8 MHz 8 MHz Option Bits OSC PLLOFF 1 0 0 1 1 0
Bit 4 = OSC RC Oscillator selection 0: RC oscillator on 1: RC oscillator off Note: If the RC oscillator is selected, then to improve clock stability and frequency accuracy, it is recommended to place a decoupling capacitor, typically 100nF, between the VDD and VSS pins as close as possible to the ST7 device.
Note: See Clock Management Block diagram in Figure 12. Bits 3:2 = Reserved Bit 1 = WDG SW Hardware or software watchdog This option bit selects the watchdog type. 0: Hardware (watchdog always enabled) 1: Software (watchdog to be enabled by software)
OPTION BYTE 0 7 Reserved Default Value 1 1 1 1 0 7 PLL OFF 1 FMP FMP SEC1 SEC0 Res. R W 1 1 0 0 1
Bit 0 = WDG HALT Watchdog Reset on Halt This option bit determines if a RESET is generated when entering HALT mode while the Watchdog is active. 0: No Reset generation when entering Halt mode 1: Reset generation when entering Halt mode
OPTION BYTE 1 0 WDG WDG Res. OSC Res. Res. SW HALT 1 0 1 1 1 1
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DEVICE CONFIGURATION AND ORDERING INFORMATION (Cont'd) 15.3 FLASH DEVICE ORDERING INFORMATiON Figure 73. Flash Device Types
DEVICE E2DATA PINOUT PROG MEM PACKAGE VERSION TR E
E = Leadfree (ECOPACKTM option) Conditioning options: TR = Tape and Reel (left blank if Tube) A = -40 to +85C B = -40 to +105C M = Plastic Small Outline 0 = 1.5 Kbytes Y = 16 pins 5 = No E2 data 9 = E2 data (128 bytes) ST7FL0
Table 24. Flash User Programmable Device Types
Part Number ST7FL05Y0MA ST7FL09Y0MA ST7FL05Y0MB ST7FL09Y0MB 1.5K Flash Program Memory (Bytes) Data EEPROM (Bytes) 128 128 128 -40 to +105C RAM (Bytes) Temp. Range -40 to +85C SO16 Package
15.4 TRANSFER OF CUSTOMER CODE Customer code is made up of the FASTROM contents and the list of the selected options (if any). The FASTROM contents are to be sent on diskette, or by electronic means, with the S19 hexadecimal file generated by the development tool. All unused bytes must be set to FFh. The selected options are communicated to STMicroelectronics using the correctly completed OPTION LIST appended. Refer to application note AN1635 for information on the counter listing returned by ST after code has been transferred. The STMicroelectronics Sales Organization will be pleased to provide detailed information on contractual points.
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DEVICE CONFIGURATION AND ORDERING INFORMATION (Cont'd) Figure 74. FASTROM Commercial Product Code Structure
DEVICE E2DATA PINOUT PROG MEM PACKAGE VERSION / XXX R E
E = Leadfree (ECOPACKTM option) Conditioning options: R = Tape and Reel (left blank if Tube) Code name (defined by STMicrolectronics) Not present if Tape and Reel A = -40 to 85C B = -40 to 105C M = Plastic Small Outline 0 = 1.5 Kbytes Y = 16 pins 5 = No E2 data 9 = E2 data (128 bytes) ST7PL0
Table 25. FASTROM Factory Coded Device Types
Part Number ST7PL05Y0MA ST7PL09Y0MA ST7PL05Y0MB ST7PL09Y0MB 1.5K FASTROM Program Memory (Bytes) Data EEPROM (Bytes) 128 128 128 -40 to +105C RAM (Bytes) Temp. Range -40 to +85C SO16 Package
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ST7L0x FASTROM MICROCONTROLLER OPTION LIST (Last update: December 2006) Customer Address Contact Phone No Reference FASTROM Code*: *FASTROM code name is assigned by STMicroelectronics. FASTROM code must be sent in .S19 format. .Hex extension cannot be processed. Device Type/Memory Size/Package (check only one option): FASTROM DEVICE SO16: 1.5K [ ] ST7PL05 [ ] ST7PL09
Warning: Addresses 1000h, 1001h, FFDEh and FFDFh are reserved areas for ST to program RCCR0 and RCCR1 (see Section 7.1 on page 23). Conditioning (check only one option): [ ] Tape & Reel Special marking: [ ] No Authorized characters are letters, digits, '.', '-', '/' and spaces only. Maximum character count: SO16 (11 char. max): _ _ _ _ _ _ _ _ _ _ _ Temperature range: [ ] A (-40 to +85C) Clock Source Selection: [ ] External Clock Sector 0 size: [ ] 0.5K Read-out Protection: [ ] Disabled Flash Write Protection: [ ] Disabled PLL: [ ] Disabled Watchdog Selection: [ ] Software Activation Watchdog Reset on Halt: [ ] Disabled [ ] Tube [ ] Yes "_ _ _ _ _ _ _ _ "
[ ] B (-40 to +105C) [ ] Internal RC Oscillator [ ] 1K [ ] Enabled [ ] Enabled [ ] Enabled [ ] Hardware Activation [ ] Enabled
[ ] 1.5K
Comments: Supply operating range in the application: ........................................................................................................ Notes: ............................................................................................................................................................... Date: ................................................................................................................................................................. Signature: ......................................................................................................................................................... Important note: Not all configurations are available. See Section 15.2 on page 96 for authorized option byte combinations.
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16 DEVELOPMENT TOOLS
16.1 INTRODUCTION Development tools for the ST7 microcontrollers include a complete range of hardware systems and software tools from STMicroelectronics and thirdparty tool suppliers. The range of tools includes solutions to help you evaluate microcontroller peripherals, develop and debug your application, and program your microcontrollers. 16.2 DEVELOPMENT TOOLS AND DEBUGGING 16.3 PROGRAMMING TOOLS During the development cycle, the ST7-DVP3 and ST7-EMU3 series emulators and the RLink provide in-circuit programming capability for programming the Flash microcontroller on your application board. ST also provides a low-cost dedicated in-circuit programmer, the ST7-STICK, as well as ST7 Socket Boards which provide all the sockets required for programming any of the devices in a specific ST7 sub-family on a platform that can be used with any tool with in-circuit programming capability for ST7. For production programming of ST7 devices, ST's third-party tool partners also provide a complete range of gang and automated programming solutions, which are ready to integrate into your production environment. 16.4 ORDER CODES FOR DEVELOPMENT AND PROGRAMMING TOOLS Table 26 below lists the ordering codes for the ST7L0x development and programming tools. For additional ordering codes for spare parts and accessories, refer to the online product selector at www.st.com/mcu.
Application development for ST7 is supported by fully optimizing C Compilers and the ST7 Assembler-Linker toolchain, which are all seamlessly integrated in the ST7 integrated development environments in order to facilitate the debugging and fine-tuning of your application. The Cosmic C Compiler is available in a free version that outputs up to 16 Kbytes of code. The range of hardware tools includes full-featured ST7-EMU3 and cost effective ST7-DVP3 series emulators. These tools are supported by the ST7 Toolset from STMicroelectronics, which includes the STVD7 integrated development environment (IDE) with high-level language debugger, editor, project manager and integrated programming interface.
16.4.1 Order Codes for ST7L0x Development Tools Table 26. Development Tool Order Codes for the ST7L0 Family
MCU DVP Series ST7FL05, ST7FL09 ST7MDT10-DVP31) ST7MDT10-EMU3 Emulator EMU Series Programming Tool In-circuit ST Socket Boards5) Programmer 2)3) ST7-STICK ST7SB10-SU02) STX-RLINK4)
Notes: 1. Includes connection kit for DIP16/SO16 only. See "How to order an EMU or DVP" in ST product and tool selection guide for connection kit ordering information 2. Add suffix /EU, /UK or /US for the power supply for your region 3. Parallel port connection to PC 4. USB connection to PC 5. Socket boards complement any tool with ICC capabilities (ST7-STICK, InDART, RLINK, DVP3, EMU3, etc.)
16.5 ST7 APPLICATION NOTES All relevant ST7 application notes can be found on www.st.com.
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17 KNOWN LIMITATIONS
17.1 EXECUTION OF BTJX INSTRUCTION Description Executing a BTJx instruction jumps to a random address in the following conditions: The jump goes to a lower address (jump backward) and the test is performed on data located at the address 00FFh. 17.2 IN-CIRCUIT PROGRAMMING OF DEVICES PREVIOUSLY PROGRAMMED WITH HARDWARE WATCHDOG OPTION Description In-Circuit Programming of devices configured with Hardware Watchdog (WDGSW bit in option byte 1 programmed to 0) requires certain precautions (see below). In-Circuit Programming uses ICC mode. In this mode, the Hardware Watchdog is not automatically deactivated as one might expect. As a consequence, internal resets are generated every 2 ms by the watchdog, thus preventing programming. The device factory configuration is Software Watchdog so this issue is not seen with devices that are programmed for the first time. For the same reason, devices programmed by the user with the Software Watchdog option are not impacted. The only devices impacted are those that have previously been programmed with the Hardware Watchdog option. Workaround Devices configured with Hardware Watchdog must be programmed using a specific programming mode that ignores the option byte settings. In this mode, an external clock, normally provided by the programming tool, has to be used. In ST tools, this mode is called "ICP OPTIONS DISABLED". Sockets on ST programming tools (such as ST7MDT10-EPB) are controlled using "ICP OPTIONS DISABLED" mode. Devices can therefore be reprogrammed by plugging them in the ST Programming Board socket, whatever the watchdog configuration. When using third-party tools, please refer the manufacturer's documentation to check how to access specific programming modes. If a tool does not have a mode that ignores the option byte settings, devices programmed with the Hardware watchdog option cannot be reprogrammed using this tool. 17.3 IN-CIRCUIT DEBUGGING HARDWARE WATCHDOG WITH
In-Circuit Debugging is impacted in the same way as In-Circuit Programming by the activation of the hardware watchdog in ICC mode. Please refer to Section 17.2. 17.4 CLEARING ACTIVE INTERRUPTS OUTSIDE INTERRUPT ROUTINE When an active interrupt request occurs at the same time as the related flag or interrupt mask is being cleared, the CC register may be corrupted. Concurrent interrupt context The symptom does not occur when the interrupts are handled normally, that is, when: - The interrupt request is cleared (flag reset or interrupt mask) within its own interrupt routine - The interrupt request is cleared (flag reset or interrupt mask) within any interrupt routine - The interrupt request is cleared (flag reset or interrupt mask) in any part of the code while this interrupt is disabled If these conditions are not met, the symptom can be avoided by implementing the following sequence: Perform SIM and RIM operation before and after resetting an active interrupt request Example: SIM rReset flag or interrupt mask RIM
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18 REVISION HISTORY
Table 27. Revision History
Date 27-Mar-06 Revision 1 Initial Release Changed "Memories" on page 1 Changed last paragraph of Section 5.5 on page 18 Changed description of bits 11:0 of CNTR register in Section 11.2.6 on page 50 Changed IVSS, IVDD and IIO maximum values in Section 13.2.2 on page 74 Changed ACCRC parameter for RC oscillator operating conditions in Section 13.3.2 on page 75 Removed note "tested in production" from Figure 44 on page 77 Changed values for tv(MO) and th(MO) in Section 13.10.1 on page 89 Replaced "CPHA = 0" with "CPHA = 1" in Figure 66 on page 90 Repositioned tv(MO) and th(MO) in Figure 67 on page 90 Changed values and note 3 in Table 20 on page 93 and Table 21 on page 93 Removed figure 72 "16-Pin Plastic Dual In-Line Package, 300-mil Width" from Section 14.1 on page 94 Changed Section 14.3 on page 95 Changed Table 22 on page 95 Changed Section 15.3 on page 98 by adding Figure 73. Flash Device Types and Table 24, "Flash User Programmable Device Types," on page 98 Changed Section 15.4 on page 98 by adding Figure 74. FASTROM Commercial Product Code Structure and Table 25, "FASTROM Factory Coded Device Types," on page 99 Updated "ST7L0x FASTROM MICROCONTROLLER OPTION LIST (Last update: October 2006)" on page 100 Changed Section 16 DEVELOPMENT TOOLS Removed section STARTER KITS from Section 16 DEVELOPMENT TOOLS Removed Starter Kits from Table 26, "Development Tool Order Codes for the ST7L0 Family," on page 101 Added a statement to indicate that application notes can be found on the ST website and removed Table 26, ST7 Application Notes from Section 16.5 on page 101 Updated disclaimer (last page) to include a mention about the use of ST products in automotive applications Replaced "ST7L0" with "ST7L05, ST7L09" in document name on page 1 Added "Features" heading above list of features on page 1 Added table number to "Device Summary" on page 1 Changed title of Section 1 on page 5 Table 2 on page 7: Removed caution about PB0 negative current injection restriction Section 7.4.1 on page 26: Added caution about avoiding unwanted behavior during Reset sequence Section 11.2.6 on page 50: Changed description of bits 11:0 of CNTR register (last sentence which had been inadvertantly removed in Rev. 2 has now been restored) Section 13.2.2 on page 74: - Replaced "Injected current on PB0 and PB1 pins" with "Injected current on PB1 pin" in ratings - Changed note 5 to remove PB0 negative current restriction Section 13.3.2 on page 75: Changed ACCRC parameter for RC oscillator operating conditions Section 14.3 on page 95: Removed text concerning Pb-containing packages Table 22 on page 95: - Changed title of Plating Material column - Added Pb solder paste - Removed note 1 Removed link to st.com from bottom of "ST7L0x FASTROM MICROCONTROLLER OPTION LIST" on page 100 Description of changes
09-Oct-06
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